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FOIA Number: 2008-1524-F
FOIA
MARKER
This is not a textual record. This is used as an
administrative marker by the William J. Clinton
Presidential Library Staff.
Collection/Record Group:
Clinton Presidential Records
Subgroup/Office of Origin:
Office of Science and Technology Policy
Series/Staff Member:
Skip Johns
Subseries:
OA/ID Number:
10672
FolderID:
Folder Title:
Sematech Inc [1]
Stack:
Row:
Section:
Shelf:
Position:
S
66
4
5
1
SEMATECH
2706 Montopolis Drive Austin, Texas 78741-6499 512-356-3500
April 28, 1995
Mr. Lionel (Skip) Johns
Assoc. Dir. for Tech. Policy
OSTP
OEOB
Washington, D.C. 20500
Dear Mr. Johns:
I am pleased to provide you with this advance copy of the 1994 SEMATECH
Annual Report. I believe you will find it to be an informative affirmation of our successful
partnership with the Department of Defense.
Semiconductor manufacturing leadership is critical to America's national defense
and our national economy. SEMATECH has played an important role in helping the U.S.
semiconductor industry and the U.S. semiconductor equipment industry regain world
marketshare leadership from Japan. At the same time, SEMATECH has delivered state-
of-the-art technology that DOD needs to fulfill its mission of protecting our national
security. SEMATECH continues to be one of DOD's core R&D programs that enables
the military to obtain critical technology to increase weapons system capability, reliability
and cost effectiveness.
As you know, SEMATECH's Board of Directors announced last summer that the
consortium would end direct federal funding after FY 1996. SEMATECH needs full
funding for FY 96 to finish its technology programs already underway and to ensure an
orderly transition to the next phase of government-industry cooperation. The Department
of Defense was included in the planning for the transition and fully supports it.
SEMATECH's member companies are committed to continuing the consortium and
will match FY 1996 funding dollar-for-dollar just as they have always done. After FY 96,
the member companies will directly fund SEMATECH's operational costs. SEMATECH
will continue to work with the federal government, primarily through the auspices of the
Semiconductor Technology Council, to help coordinate R&D investments in this critical
industry.
Thank you for your support and your interest in SEMATECH. Please do not
hesitate to call on us if you have any questions or need additional information. Our new
telephone number is 202-737-0904. We look forward to working with you in 1995.
Sincerely
Mark Nelson
Director of Government Relations
A Team of America's Best Advanced Micro Devices, Inc. Advanced Research Projects Agency (ARPA) American Telephone and Telegraph Company
Digital Equipment Corporation Hewlett-Packard Company Intel Corporation International Business Machines Corporation Motorola, Inc.
National Semiconductor Corporation NCR Corporation Rockwell International Corporation Texas Instruments Incorporated
Clinton Presidential Records
Digital Records Marker
This is not a presidential record. This is used as an administrative
marker by the William J. Clinton Presidential Library Staff.
This marker identifies the place of a publication.
Publications have not been scanned in their entirety for the purpose
of digitization. To see the full publication please search online or
visit the Clinton Presidential Library's Research Room.
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Clinton Presidential Records
Digital Records Marker
This is not a presidential record. This is used as an administrative
marker by the William J. Clinton Presidential Library Staff.
This marker identifies the place of a publication.
Publications have not been scanned in their entirety for the purpose
of digitization. To see the full publication please search online or
visit the Clinton Presidential Library's Research Room.
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1994
Annual
Report
SEMATECH
SEMATECH
2706 Montopolis Drive . Austin, Texas 78741-6499 . 512-356-3500
Karen Ellis
May 8, 1995
Mr. Lionel (Skip) Johns
1341 G St. N.W., Suite 620
TEL: 202-737-0904
Assoc. Dir. for Tech. Policy
Washington, DC 20005
FAX: 202-737-0909
OSTP
[email protected]
OEOB
Washington, D.C. 20500
Dear Mr. Johns:
Enclosed you will find SEMATECH's 1994 Environment, Safety and Health Status
Report. The document highlights how SEMATECH is meeting the environmental intent
of Congress as specified in the language of the Armed Services Conference Committee
Report on the Department of Defense Authorization Act for Fiscal Year 1994. Further,
the report specifically illustrates how SEMATECH invested more than $20 million in
environmentally-sensitive manufacturing programs ($11 million more than the amount
allocated by Congress).
Because of your interest and involvement in environmental affairs, I thought you
might be interested in seeing the report. For more information, contact Ann Marett; her
address and phone number is located on page one of the report. Call me if you need
additional copies.
Sincerely,
Kaun Ellin
Karen Ellis
Government Relations Specialist
A Team of America's Best Advanced Micro Devices, Inc. Advanced Research Projects Agency (ARPA) American Telephone and Telegraph Company
Digital Equipment Corporation Hewlett-Packard Company Intel Corporation International Business Machines Corporation Motorola, Inc.
National Semiconductor Corporation NCR Corporation Rockwell International Corporation Texas Instruments Incorporated
SEMATECH
Status Report:
Environment, Safety, Health
Programs
December 1994
TABLE OF CONTENTS
SEMATECH'S 1994 ENVIRONMENT, SAFETY, HEALTH PROGRAMS
1
Introduction
1
2
Issues and Challenges
5
3
Project Summary
15
4
SEMATECH's Priority Programs
29
5
National Technology Roadmap
for Semiconductors (ESH Section)
57
Appendix I
77
SEMATECH Partnership Programs
For more information contact:
Ann Marett
Communications Manager
SEMATECH
2706 Montopolis Drive
Austin, TX 78741
512-356-3327
512-356-3135 (fax)
[email protected]
This document printed on recycled paper.
Introduction
1
1
INTRODUCTION
This document details how SEMATECH is meeting the intent of Congress as
specified in the language of the Armed Services Conference Committee Report
on the DOD Authorization Act for Fiscal Year 1994. Some of the 1994 program
highlights include:
A continued emphasis throughout the SEMATECH organization on
environment, safety and health issues and technology development
resulted in more than $20 million invested in 46 projects. Approximately
20 full-time ESH professionals on staff teamed with another 100 plus
engineers and technicians to work on issues ranging from eliminating
hazardous chemicals in the manufacturing process to finding industry-
wide solutions to reduce air emissions.
The SEMATECH ESH staff was instrumental in revising the ESH section
of the National Technology Roadmap for Semiconductors. This included
ESH Director H. Ray Kerby serving as co-chair of the Technical Working
Group and coordinating meetings and input from industry, suppliers and
academia throughout the year.
Throughout 1994 SEMATECH ESH played a key role in the development
of consensus guidelines for the semiconductor industry. As active
participants in the Semiconductor Equipment & Materials International
(SEMI) Standards Facilities and Safety Committee, SEMATECH ESH
members assisted in generating more than eight ESH technology
guidelines. As a result of the increased importance that has been placed
upon the ESH component of the industry roadmap and SEMATECH's
increased participation, the Facilities and Safety focus was recently
elevated to division status.
SEMATECH co-hosted three international symposia held in the U.S.
which brought together teams of leading experts to exchange information
and develop next steps on water conservation, global warming and
ergonomics.
SEMATECH played a key role in the first international summit which
brought together world environmental technologists to discuss Total
Quality Environmental Management Programs, standards, regulations
and policies, ergonomics, equipment safety and take-back strategies.
SEMATECH teamed with the Semiconductor Industry Association to
present the U.S. story.
SEMATECH tested an experimental cleaning tool for a quartz-lined
furnace which uses a heated air process to vacuum clean the furnace. If
proven commercially feasible, this could significantly reduce the use of
hydrofluoric acid in the manufacture of computer chips.
3
The consortium leveraged national resources by successfully negotiating
and initiating the first ESH CRADA project (photocatalytic oxidation of
organic emissions) with the National Renewable Energy Laboratory in
Golden, Colorado.
SEMATECH contracted with the Semiconductor Research Corporation
(SRC) to investigate six ESH/process topics at five universities. Project
areas include water conservation, aqueous photoresist, CVD process
optimization, plasma destruction of perfluoro compounds (PFCs) and
alternatives to PFCs which are potential global warming agents. In
addition, SEMATECH funded approximately $11 million of university
research through SRC, an industry consortium.
Fifteen contracts were initiated for 16 ESH projects. Four projects were
completed including the associated 10 technology transfer deliverables.
Coordinated approximately 30 Focus and Project Technical Advisory
Board meetings which brought together top environment, safety and
health professionals from our member companies to consult on
technology development projects.
More than 30 presentations throughout the country were made to update
industry, academia and supplier communities on SEMATECH ESH
programs or the National Roadmap.
The following sections specifically document how SEMATECH invested more
than $20 million in environmentally-sensitive manufacturing programs ($11
million more than the amount allocated by Congress):
Section
2
SEMATECH ESH Project Summary is a compilation of the technology
projects with a specific ESH benefit. SEMATECH has invested more
than $20 million in these 46 projects in 1994.
3
SEMATECH's Priority Programs detail the seven projects designated
as ESH priorities by SEMATECH member companies.
4
SEMATECH's ESH Strategic Plan for 1995 is detailed in this section.
5
National Technology Roadmap for Semiconductors. The ESH
Section of the industry roadmap is included.
4
Issues and Challenges
2
5
2
ISSUES AND CHALLENGES
The U.S. semiconductor industry is moving decisively toward designing for
environmentally-sensitive manufacturing processes and materials. SEMATECH
has played a key role in coordinating efforts on an industry-wide basis to reach
a consensus on priority programs.
The National Technology Roadmap for Semiconductors was revised and
published in 1994 and is included in this book in Section 4.
Following is a discussion of issues and challenges facing our industry and the
SEMATECH strategy for addressing them.
7
2
ISSUES AND CHALLENGES
To achieve major improvements in the ESH performance of the factory,
equipment, processes, and products, there is a critical need to put ownership of
solutions into the hands of those who are developing and building the
equipment and facilities for chip manufacturing or packaging. The ESH
community must support this ownership with aggressive programs to provide
design methodology, analytical models and tools, and technical programs of
unique or broad-based ESH technology. The following list summarizes the key
technology needs :
1.
Comprehensive mass balance, cost of ownership, and risk assessment
capabilities are needed to achieve a complete Design for Environment,
Safety, and Health (DFESH) in chip fabrication and packaging. These
tools, procedures, and guidelines need to be integrated with the tools
used by engineers for future process, chemistry, and equipment selection
methodology.
2.
Eliminating chemicals, using lower hazard chemicals, and using process
chemicals more efficiently are some of the techniques needed to reduce
the hazards and environmental emissions impact of process and
packaging chemicals.
3.
Abatement technology improvements, in their effectiveness across a
range of chemicals and in their cost of ownership, are needed to further
reduce emissions, especially during the first half of the 15-year strategic
period outlined in the National Technology Roadmap for Semiconductors.
4.
Energy management and technology are needed to adequately reduce
equipment and facility energy consumption. The roadmap goal in 1998
is to maintain 1993 levels of energy per unit area of silicon.
5.
Cost-effective water conservation technologies are needed. This
includes more efficient water use in processes and ultrapure water
recycling.
6.
Worker protection improvements are needed in equipment and facility
ergonomics standards. The industry needs to reduce its dependence on
cleanroom garments and personal protective equipment.
To achieve the Roadmap requirements, ESH programs will be championed and
co-developed by SEMATECH'S ESH Department and the rest of SEMATECH's
manufacturing thrust groups. Resources in the ESH Department are dedicated
to:
9
1.
Develop DFESH tools, including mass balance, cost of ownership, and
risk assessment tools, for use by SEMATECH thrusts, by equipment
suppliers, and by engineering management at producer facilities
2.
Develop short- and long-term air abatement solutions for several classes
of gaseous emissions
3.
Implement other projects including water, energy, and worker protection
(using Roadmap requirements and the ESH Focus Technical Advisory
Board to set priorities)
Strategic Plan
-
To "build in" ESH solutions, ESH improvements will continue to be
incorporated into the technical objectives of thrust and cross-thrust
projects. Chemical reduction, water and energy conservation,
ergonomics improvements, and DFESH tool use will be emphasized.
-
Member companies' and suppliers' interest and involvement will be
promoted to improve ownership, technology insertion, and effective
solutions.
-
An ESH Supplier Advisory Council will continue to bring an equipment,
chemical, worker protection, and supplier perspective to the Roadmap
and program strategy.
Many universities, federal labs, and other government agencies have
ESH programs, especially in the environmental areas. Taking advantage
of these resources and focusing them on ESH issues for this industry is
important, especially to address needs beyond 2-3 years. The thrust will
work to focus on ESH through SCOEs, an ESH Center of Competence,
and/or other mechanisms.
There is ESH technology, which is potentially adaptable to the
semiconductor industry, that is being used or developed in other
industries and/or other countries. Benchmarking efforts will look to these
sources. The ESH thrust will maintain the ESH portion of the National
Roadmap through the ESH Technology Working Group (TWG) and other
sources, and it will measure overall progress against the Roadmap. It is
especially important over the next 2-3 years to baseline environmental
parameters including energy, water, and chemical use/emissions to be
able to measure progress.
10
Programs
Design for Environment, Safety, and Health Tools-The key tools and
models that will be developed in the ESH thrust include cost of ownership,
mass balance, risk assessment, and equipment by-product characterization.
The 1994 cost of ownership modeling for chemicals will be extended to include
energy/water and will be incorporated into the SEMATECH Cost of Ownership
model. With supplier involvement, mass balance modeling and methodology will
be developed for and applied to major equipment. Chemical risk assessment
modeling will provide a tool for weighing all risk elements when comparing
alternative chemical use solutions. By-product analysis of key etch and CVD
tools, followed by analysis of all 0.25mm tools late in the strategic period, will
enhance mass balance capability and reduce safety hazards.
Hazardous Chemical Use Reduction-The National Roadmap calls for
reducing the use of three lists of chemicals (approximately 60 compounds) used
in mask making, lithography, cleaning, lead frame plating, deflashing, and
soldering. In addition, the Roadmap calls for reducing the use of perfluoro
compounds (used as etchants), silane (used in deposition), and thermoplastic
(as opposed to thermoset) packaging. To complement member company
phase-out of solvent-based negative photoresists, SEMATECH will address
minimizing ≤0.35mm lithography chemical use by developing
nonethylene-glycol-based resists (for silicon and mask), by reducing resist
dispense per wafer by 4-fold, and by sponsoring research in aqueous-based
photoresists. The work will also develop chemical reprocessors, safer
alternatives for dopants and silane, and alternatives to long-lived gases (the
perfluoro compounds). An investment in long-term exploratory research will
investigate additive process technologies and other innovative technologies that
offer potentially major ESH improvements.
Emissions Reduction-To provide more effective and lower cost abatement of
air emissions early in the strategic period, several parallel efforts will be
pursued. Efficiency and cost studies will be done of corrosive scrubber
operating parameters. The studies will help determine the optimal operating
conditions, performance limitations, incompatible systems, and costs. Organic
emission abatement system data collection will provide benchmark, cost of
ownership, and performance information primarily for current volatile organic
compounds thermal treatment technology. This will provide baseline
information for developing future technologies with specific cost reduction goals.
Feasibility studies for and the development of low-cost emerging technologies
will be pursued.
Near-term perfluoro compound abatement is being addressed with thermal
treatment technology. Long-term plasma treatment and recovery technology
are being evaluated to reduce cost. The solutions developed will be used to
11
reduce emissions beyond the levels achieved in the next few years by chemical
use reduction. Point-of-use abatement (equipment level) will be considered and
implemented where cost effective.
Energy Reduction-There is not a formal program in place yet, but a total
budget focus and management program will be developed at SEMATECH. The
Facilities Council has taken the lead to this point. The high energy
consumption equipment areas are sensitive to the need in National Roadmap
for 1998 to not increase energy per m² of silicon over 1993 levels. Facility
energy consumption in cleanroom air conditioning is a large energy component
that should be systematically studied for technology improvement. A baseline
study and strategy needs to be developed.
Water Reduction-Water conservation is an acute problem in some
manufacturing locations and is a growing chronic problem across the industry.
There is a coordinated effort in this area between ESH and the Materials and
Bulk Processes, Facilities, and Contamination Free Manufacturing thrusts.
Planned activities include a baseline of water use, a pilot of ultrapure water
recycling technology, a determination of purity requirements, and an
optimization of process use. The overall objective is a 50% reduction in water
use per m² of silicon processed in 1998 over 1988.
Worker Protection/Ergonomics-The program strategy is to further isolate the
process from the person, by using such techniques as enclosed tools (e.g., the
Advanced Wet Station), minienvironments, and realtime, online exposure
monitoring technologies. The use of minienvironments will reduce the reliance
on garments to prevent contamination of the process. From an ergonomics
standpoint, an ideal factory layout will be developed to optimize people and
product flow. Ergonomic and safety factors will be designed into the 300mm
automated wafer handling systems, including intra- and interequipment
transport and loading and software and hardware interlocks.
Critical Decisions
The means to implement the National Roadmap and the SEMATECH strategy
must be adapted to the changing resources including federal programs,
suppliers, and member companies.
Coordinated Effort
-
The ESH Technical Working Group and Supplier Advisory Council
provide important coordination as well as strategic and technology issue
perspective across the industry.
Close coordination with the Semiconductor Industry Association ESH
Committee is an important ongoing mechanism of two-way ESH
communications with semiconductor producers.
12
-
The Semiconductor Safety Association and Semiconductor Industry
Association are ongoing partners with SEMATECH in ESH symposia.
-
The MCC electronics industry ESH roadmap is coordinated with, and
refers to, the ESH National Technology Roadmap for Semiconductors.
-
To support member company interests, the ESH thrust will coordinate
strategy and technology input to the EPA Common Sense Initiative
program in the electronics industry.
-
Member company ESH research and development efforts will be
coordinated and leveraged with ESH thrust projects whenever possible.
-
Coordination will continue with the National Center for Manufacturing
Sciences environmental sensor development program to prevent
duplication of effort.
13
SEMATECH STRATEGIC PLAN ESH ROADMAP
TOTAL THRUST BUDGET
1994
1995
1996
1997
1998
1999
2000
SEMATECH TIMELINE
0.25 mm. 200 =
0.18 = 200-400 mm
0.12 MEL 200-400 -
DFESH Tools
Cost of Ownership⁸
Risk
By-products
*
Mass Balance
Hazardous Chemical
Use Reduction
Photochemistry¹
Perfluoro compounds⁶
Hydrides³
Reprocessing³.4.⁵
Additive Process Rsch3
Emissions Reduction
Organics
Corrosives
Perfluoro compounds⁶
Point of Use¹
Energy/Water
Reduction
Energy³.5,6.7
Water³.4.5
Worker Protection
(Ergonomics)
Factory Layout⁷,⁸
Automated Mat. Handling⁷.⁹
Enclosed Equipment³
Real-time Sensors
Note: Programs that are championed by or co-developed with:
1. Lithography
4. CFM
7. Future Factory
2. Packaging and Assembly
5. Facilities
8. Modeling and Statistical Methods
3. MBP
6. Interconnect
9. Manufacturing Systems Development
Start
Proof of
1s: Prototype
Qualification
Info Avail.
End
Concept
or Valid/Char
Decision
Pilo: Line
Prod Deliv.
Shade - completed by end of 3Q94
Contributes to follow-on projec:
14
SEMATECH ESH Programs
Project Summary
3
15
3
SEMATECH ESH PROJECT SUMMARY
This section contains a compilation of the technology projects with a specific
ESH benefit.
SEMATECH has invested more than $20 million in these 46 projects.
In 1993, SEMATECH implemented a program which analyzes the
environmental benefit of all of our technology programs. A set of 10 criteria
was developed by which to judge each program.
The criteria are used at SEMATECH Project Advisory Board meetings to assess
the ESH content of all new projects. If a project meets one or more of these
criteria, we have assigned a percentage factor which reflects our estimate of
the proportion of the total program cost to produce the ESH benefit. These
criteria are consistent with the ESH section of the industry roadmap. This
process was developed in Q4 1992 and formalized in Q1 1993.
Criteria are:
1.
Potential for eliminating, substituting, or decreasing usage of hazardous
materials
2.
Continuously improve control of hazards such as employee exposures,
high temperatures, high voltages, fire or explosion potential
3.
Recycle, recover, or reprocess water, energy, or hazardous materials
4.
Consume less energy or conserve resources
5.
Characterize or identify reaction by-products for proper handling and
disposal
6.
Improve abatement or destroy hazardous pollutants from processes
7.
Improve monitoring or detection of hazardous pollutants from processes
8.
Improve tracking of hazardous materials that will provide data for
understanding of consumption, emissions, and wastes
9.
Reduce the volume of waste material per area of silicon processed, and
reduce the use of non-renewable resources
10.
Improve ergonomic aspects of tools, software, and equipment
17
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
CONTAMINATION FREE MANUFACTURING
S49
Minienvironment
Ergonomic considerations for minienvironments as they relate to
Develop a safety standard for minienvironments,
Project
production.
S51
High Sensitivity
Prevent the release of corrosive gas into the environment,
Develop real time moisture sensors to prevent failure due to
Sensors
optimize chemical consumption.
corrosion. Optimize chemical and water consumption using
metal sensors.
S51
Organic
Better methods for analysis can provide earlier warning and better
Provide better methods for measuring potentially hazardous
Contamination and
detection of hazardous materials.
organics.
19
Impact
S51
Wafer Cleaning
Where feasible, demonstrate effectiveness of dilute chemistries
Support ESH needs where feasible by exploring reduced
Task 5
and reduce water use.
chemical and water use.
S59
Plasma Modeling
Improved utilization of etch gas chemistries.
Obtain a fundamental understanding of plasma etch chemistry
leading to an improved utilization of etch gases and/or
replacement of gases currently used with chemistries that are
more environmentally safe.
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
INTERCONNECT
E50
AMAT Omega
Reduce concentration of perfluoro compounds (PFC) by
Contract with supplier on use of combustion decomposition unit
Oxide Etch
destroying 90% of C2F₆ before it leaves the exhaust stream.
to understand the process of PFC.
Equipment
Improvement
Program
E51
Advanced
Improvement of throughput. Ergonomics: make tool easier to
Ironman approach: Split up time, where 8 hours of the day is
Polisilicon Etch
maintain by improving tool.
spent in engineering (upgrading, running experiments, etc.); and
the 16 hours left are used in cycling tool to test the upgrades.
20
E53
Gap Fill Interlevel
SEMI S2-93 Certification
Certify to SEMI S2-93 guidelines and implement any
Dielectric
recommended improvements.
E55
Collimated PVD
Extend and preserve the environmentally friendly physical vapor
Extend and preserve the environmentally friendly PVD
TiN
deposition (PVD) technology, in lieu of chemical vapor deposition
technology, in lieu of CVD, for the Ti/TiN contact and via liner
(CVD), for the titanium/titanium nitride (Ti/TiN) contact and via
application by demonstrating competitive technical and cost
liner application by demonstrating competitive technical and cost
capability.
capability.
E56
Varian Electrostatic
Implement and successfully test appropriate high voltage and
Implement and successfully test appropriate high voltage and
Chuck (ESC)
temperature exposure interlocks according to SEMI S2-93 while
temperature exposure interlocks according to SEMI S2-93 while
developing a high temperature electrostatic chuck (ESC).
developing a high temperature ESC.
E57
LAM 9600
To improve stripper module and etch in order to eliminate many
Defect reduction and reliability improvement through the use of
Equipment
or all of the solvents.
an Ironman methodology and process development and
Improvement
capability demonstration.
Project
E59
Hi-density Plasma
SEMI S2-93 Certification, C2F₆ emission reduction.
Certify to SEMI S2-93 guidelines and implement any
Enhanced
recommended improvements. Process chemistry investigation.
Chemical Vapor
Purchase or modify tool hardware to reduce C2F₆ emissions.
Deposition
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
E64
Speedfam
SEMI S2-93 Certification
Certify to SEMI S2-93 guidelines and implement any
Equipment
recommended improvements.
Improvement
Program
E66
Westech 372M
SEMI S2-93 Certification
Certify to SEMI S2-93 guidelines and implement any
recommended improvements.
J91
Low Temperature
Select new chemicals with less toxic or hazardous properties.
Funding precursor supplier for Toxic Substance Control Act
CVD TiN
review and documentation for Material Safety Data Sheet,
reaction products analysis, shelf life and handling analysis, and
abatement study.
21
J103
Chemical
The dry strip of nitride film in a Locos isolation process will
Develop the best of breed chemical downstream etch tool(s) to
Downstream Etch/
eliminate the use of hot phosphoric acid.
replace the use of hot phosphoric acid for nitride strip.
Elimination of
Phosphoric Acid
Joint Development
Program
J131
Rodel
Increasing the removal rate for sheet thermal oxide chemical-
A systematic investigation of the effect of various consumable
Consumables
mechanical polishing will increase throughput and decrease slurry
sets on established polishing performance metrics will be
Characterization
consumption.
conducted. Design of Experiment methodology will be used to
Project
characterize the effect of varying pad manufacturing parameters
on polishing performance.
J132
CVD TiN
SEMI S2-93 Certification
Certify to SEMI S2-93 guidelines and implement any
recommended improvements.
S112
Chemical
Conduct a feasibility study to explore alternate chemistries for
Screen potential chemistries to determine which ones may be
Mechanical
metal polishing. The objective is to find less hazardous chemicals
non-hazardous.
Polishing (CMP)
to reduce employee exposure and disposal costs. Reduce the
Development
use of existing slurry by improving process performance.
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
LITHOGRAPHY
J51
Positive Deep UV
Develop, optimize and commercialize a resist for 0.35um
Complete dissolution studies required to convert to the safer
Resist
lithography that uses a safer solvent. Improve monitoring or
solvent, propylene glycol mono methyl ether acetate (PGMEA)
detection equipment for ppb solvent detection.
or ethyl lactate for the less safe solvent DIGLYME. Conduct
feasibility testing of analytical and collection technologies to
detect ppb levels of amines.
J112
Mask Process and
Identify an aqueous developable photoresist for e-beam exposure
Provide cooperative development/evaluations of advanced
A, B, D
Cleaning
that has equivalent or better performance than the solvent-
resists/ processes for mask writing and soft defect
developed photoresist currently in use. Replacement resist will
inspection/cleaning capability.
likely be non-ethylene glycol-based.
22
J120
0.25um Resist
Ensure resist development for 0.25um lithography. Uses a safer
Complete dissolution studies required to convert to the safer
Development
solvent alternative to DIGLYME®. Improve monitoring or
solvent PGMEA or ethyl lactate. Conduct feasibility testing of
detection equipment for ppb solvent detection.
analytical and collection technologies to determine best
available methods.
200-001
Point-of-Use
Collaborate with SEMATECH's ESH Department to develop
Reduce facility-wide VOC emission and/or abatement cost by
Volatile Organic
facility-wide cost/impact models for VOC abatement technologies.
developing VOC cost/impact models and demonstrating a point-
Compound (VOC)
Demonstrate technical feasibility for point-of-use abatement at the
of-use VOC abatement system for photoresist coat applications.
Abatement at
photoresist coat operation.
Resist Coat
Operation
200-002
Advance Track
Design and build coater bowl inserts that improve exhaust flow
Use Massachusetts Institute of Technology Finite Element
Modeling
dynamics and allow for the separation of the bowl exhaust and
Analysis software to design inserts. Fabricate inserts. Verify
the resist drain that reduces the amount of solvent in the stream
flow improvements of member beta sites.
exhaust.
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
S118
Resist Minimization
Supply the member company community with prototype(s)
Conduct multiple parallel feasibility prototype development, and
performance capability to use less than 1.0 milliliters of resist for a
evaluations done on one track tool at SEMATECH. Resist
200mm wafer coat/per level that is transferable to other wafer size
application technique(s) studied using different technologies
configurations. Benefits are reduction in waste (-4x) to dispose
through university/suppliers will increase chance of success.
(ESH), reduction of track cost of ownership, insertion potential to
Performance data will be reviewed to determine most promising
various tools and wafer processes.
concept(s) approach. Best approach(es) must have potential to
implement into current resist track tools (add on/upgrade kit).
Hardware product development practicality via cost of
ownership and return on investment analysis.
23
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
MATERIALS & BULK PROCESSES
E47
Batch Cluster Tool
To reduce the amount of hydrogen fluoride (HF) used and the
In collaboration with suppliers and member companies, evaluate
amount of corrosive HF produced. Also, to reduce worker
existing tool configurations.
exposure to HF.
E58
Clean-Cluster
Decrease energy, gas and chemical use and effluent emissions
Assess and improve the tool's environmental impact with
Applications
as compared to stand-alone batch processing.
respect to power, gas, and chemical use.
Development
E61
SEMITHERM VTP
1. Consume less energy or conserve resources. By reducing
Survey industry fab managers for business requirement inputs.
1500
cycle time less energy will be used to operate the tool.
Define technical and supplier development objectives which will
24
2) Model-based temperature control: reduced temperature
satisfy member company technical and business requirements.
stabilization time (reduce cycle time).
Prove out new process approach.
3) Model fast cooling of the furnace and its effect on cost of
ownership (work on reducing cycle time).
J64
Point-of-Use
(1) Install a wet deck with POUCG for HF, HCI, NH2OH, ozone at
Reduce hazards associated with transportation and distribution
Chemical
an industry site.
of chemicals.
Generation
(2) Performance characterization to include chemical assay,
(POUCG)
particles, metals, oxide integrity, and surface cleanliness.
(3) Collect reliability and cost of ownership data.
J80
Advanced Wet
Enhance worker safety through redundant chemical isolation via a
Consumables are the #1 driver for cost-of-ownership in wet
Station
mini-environment. Environmental impact will be reduced from
wafer processing. These same inputs directly impact ESH. A
current levels by a decrease in consumable and waste as follows:
rigorous cost-of-ownership model has been developed and
DI water - 40%, SC1 & SC2 chemicals . 80%, volumetric HF
sensitivity analysis applied to identify factors that will be
waste 90%.
optimized to lower cost-of-ownership and maximize ESH impact.
J95
Low Temperature
Reduce the requirements for energy, process gas consumption,
Baseline the single wafer epi tool's environmental impact
Silicon
and effluent emissions. Evaluate the improvements.
compared to the batch epi tool's and define processes to
reduce this impact.
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
J100
Stand Alone Rapid
To reduce, conserve and minimize thermal requirements for
Rapid Thermal Processor will be evaluated for temperature
Thermal Processor
processing of wafers by improving heating uniformity and by
measurement and control capability and cost-of-ownership
reducing cycle time (improving throughput of the tool).
analysis. Uniform yet efficient heating of the wafers and
throughput will be key factors for improving tool performance.
The tool will lower the thermal requirements substantially when
compared to conventional resistance heating furnace
operations.
S76
Rapid Thermal
Reduce the energy and material consumption of the installed
Understand current RTP problem set at member company
Processor Install
base RTP tool set. Improve the overall viability of RTP as
locations. Work with leading RTP supplier to improve tool set,
compared to the higher energy consuming alternatives (batch
practices and procedures that will reduce scrap, test runs, and
processing).
monitor wafer consumption. Improve the overall productivity, in
25
effect reducing the energy and materials required.
S79
Cryogenic Aerosol
The feasibility study for cryogenic aerosol wafer cleaning was
The cryogenic clean has no disposal issues because it uses
Cleaning
initiated based on the positive ESH benefits, as well as improved
argon and nitrogen gases. The cryogenic process can replace
cleaning capabilities for post etch residue removal on advanced
typical wet chemical cleaning processes that do have disposal
devices.
costs/risks associated with them, for a significant cost savings.
S58/E67
Post Oxide
Traditional oxide CMP cleaning processes use a scrubbing
Completed process development work on the scrubbing system
Chemical
process with chemical to remove CMP defects. Reduced
to reduce the amount of chemical and DI water required to
Mechanical
chemical and DI water use is a benefit to this process.
perform the clean, thus reducing chemical consumption by 15%
Polishing Clean
and DI water use by 25%. Set a goal for mid-1995 to develop a
DI water recycling system for the tool to reduce DI water use by
60%.
S120
0.25µm/0.18µm
Improve RTP component technology SO that RTP tools can
With a stronger RTP component technology, more RTP
Rapid Thermal
be used to replace furnaces.
tools will be used in preference to vertical
Processor
furnaces. RTP tools consume less electrical energy
Component
(approximately 17,500 kwH per year) than vertical
Technology
furnaces.
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
S116
Process Water
Determine current status of process water recycling
Survey the domestic industry to provide members with
Recycling
technology, assess industry needs, establish focus for
a benchmark. Develop computer-based cost model.
future research and development. Generate a computer
Assess recycle benefits and risks. Coordinate the
based cost model using current recycle technology and
technology focus with member companies,
cost options, to include an assessment of the benefits
universities, national labs and suppliers.
and risks of water recycling.
26
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
ENVIRONMENT, SAFETY & HEALTH
S66
Air Emissions
Lower cost-of-ownership (CoO) and increase performance
Optimization of existing and emerging abatement equipment,
Monitoring and
capability to measure, treat and reduce air emissions.
emissions reduction, pollution prevention. Benchmark sensors
Treatment
Demonstrate optimum performance with lowered CoO. Develop
suited for point-of-use and stack-level semiconductor fab
semiconductor specific abatement technology to protect the
emissions. Determine optimum scrubber efficiencies.
environment and conserve energy.
S67
ESH Risk
Develop a decision methodology for relative risk assessment of
Perform a benchmark study to evaluate current available risk
Assessment
hazardous materials based on ESH considerations. This tool will:
methodologies including regulatory agency checklists. Correlate
Methodology
1. Evaluate the risk of process/material alternatives for the
the benchmarking information and design a complete flowchart
Software Tool
semiconductor industry.
and logic description of a computerized risk methodology tool,
27
2. Communicate risk decisions to users.
then finalize a computerized template. Conduct beta site tests
3. Address management cost/benefit issues.
and validate the software tool. Train and provide the finished
product to member companies.
S68
Characterize
Develop methodologies to collect by-products data and
Use gas chromatograph/mass spectroscopy and Fourier
Process By-
characterize air emission and waste by-products for identified
transform infrared analysis to identify the compounds. Develop
Products
priority processes. Provide understanding of by-products in order
sampling and analytical methodologies.
to improve selection of proper personal protective equipment,
waste disposal options and appropriate treatment technologies.
Share results with other process database to predict process by-
products (long term). Provide template methodology for future
process by-products characterization.
S69
Reduce Emissions
Increase efficient use and decrease emissions of potential global
Baseline current semiconductor industry and supplier market
of Global Warming
warming semiconductor processing materials.
data. Develop efficiency and by-products test methods.
Demonstrate abatement equipment feasibility. Research
alternative etch chemistries and PFC reaction kinetics in
plasma.
1994 Projects with Environment, Safety & Health Objectives
Project
Project Name
ESH Objective
ESH Approach
No.
S70
Design for
Incorporate pollution prevention and Design for Environment,
Define and include pollution prevention in the technology
Environment,
Safety & Health (DFESH) in tool and process development.
roadmap and critical success factors for technology thrust
Safety & Health
Develop DFESH guidelines for member companies' use. Provide
areas. Conduct Life Cycle Assessment (LCA) of semiconductor
tool for proactive planning and design of equipment and
manufacturing. Review existing member company systems for
processes.
ESH incorporation and review. Develop and deliver Design for
Environment and LCA training program.
S71
Silane Safety
Best industry engineering practices will be identified and
Determining if replacing silane for silicon deposition is
Improvement
disseminated enabling improved worker safety. Risks associated
necessary and if there is a viable path toward replacement.
with engineering control methods will be evaluated and
Benchmark and disseminate best industry engineering control
disseminated enabling data driven about silane issues. The
practices. Assess risks associated with engineering controls.
silane replacement strategy which shows the highest probability of
Identify possible silane alternatives. Select, estimate cost,
28
successful development will be identified.
schedule and probability of successful development will be
identified.
955-002
Clean Air Act
Benchmark hazardous air pollutant emissions from wafer fabs.
Survey semiconductor manufacturers, equipment suppliers, and
Technology
Methods of reducing air emissions such as chemical substitution,
environmental regulatory agencies to determine current status
process changes, and abatement equipment will be evaluated.
of hazardous air pollutant emissions.
This information will be used to formulate a strategy for Maximum
Achievable Control Technology requirements under the 1990
Clean Air Act Amendments.
955-003
Alternative Dopant
Benchmark alternatives to hydride-based dopants.
Survey semiconductor manufacturers, implant vendors, source
suppliers for potential safer dopant sources.
955-004
ESH Strategic
Revise Industry ESH Roadmap. Develop SEMATECH ESH
Fund Semiconductor Research Corporation research: two
Alignment
Strategic Implementation Plan. Invest in additional longer term
water conservation projects, one aqueous photoresist
ESH resesarch projects.
development project, and one chemical vapor deposition
process optimization project. Host roadmap workshops, staff
and develop strategic plan.
SEMATECH's Priority Programs
4
29
4
SEMATECH'S PRIORITY PROGRAMS
This section details the seven projects designated as priorities by SEMATECH
member companies.
31
S66: AIR EMISSIONS MONITORING
ROADMAP ALIGNMENT
Technology
0.35pm
0.25µm
0.18µm
0.12µm
0.10pm
0.08µm
Element
1995
1998
2001
2004
2007
2010
Emission
Use abatement to reduce emissions, as necessary, until source
Reduction
reductions take effect
Focused Use
Decrease 50% from
Reduce 80% from 1988 emissions (B)
Reduction List
1988 emissions level
Reduce 80% from 1988 emissions below
A, B,C
(A)
permit trigger (C)
32
Existing Abatement
Equipment
Best CoO
S66 Technology
Abatement
Development
Technology
Emerging
Technologies
Sensors
IN R&D
IN USE
PROJECT: S66 AIR EMISSIONS TREATMENT AND MONITORING
Project Dates:
August 1994-October 1995
Project Background:
A:
Scrubbers designed for industry in general don't meet the high efficiency levels
demanded by the semiconductor industry. In general the emissions are too
dilute and the scrubbers are not designed to handle multiple streams of
chemicals.
B:
Commercially-available devices for control of volatile organic compound (VOC)
emissions have an unknown cost of ownership and variable performance and
reliability. Additionally, there are a number of different strategies that will
effectively reduce air emissions, including point-of-use abatement, alternative
treatment technologies and pollution prevention through source reduction.
C:
General VOC abatement technologies are not developed for semiconductor
industry-specific applications.
D:
Currently, the accepted analytical techniques for measuring air emissions are
extractive procedures which frequently present reliability and accuracy
problems. Additionally, regulations are unclear about the impact of emissions
monitoring requirements.
Objectives:
1.
Optimize operating and design parameters and removal efficiencies for
wet scrubbing of corrosive inorganic gas emissions.
2.
Determine CoO and performance characterization of existing VOC
abatement technologies.
3.
Evaluate, fund and manage the development of cost effective emerging
technologies to improve destruction or treatment of semiconductor
process emissions.
4.
Benchmark real-time exhaust stack, process and fence-line air
monitoring methods (fixed and portable).
Tasks:
1.
Literature search, bench-scale and pilot testing (beta sites), scrubber
modeling and optimization, design and guidance documents.
33
2.
Characterize the performance and reliability of existing VOC abatement
technologies and determine CoO comparisons. Determine cost of
ownership for 10 emerging technologies based on supplier data. Provide
modeling tools to determine optimum abatement strategy.
3.
Determine feasibility of PCO technology for four semiconductor air
emissions streams on a bench-scale basis. Demonstrate technology at a
member company site. Determine by-products and engineering
parameters.
4.
Benchmark performance and projected cost of sensor technologies for
monitoring air emissions. Provide recommendations for future
development effort for emissions monitors as well as projecting potential
impacts of emissions monitoring regulations.
S66: Air Emissions Treatment and Monitoring
S66
Program
CoO of
Wet Scrubber
Benchmark
existing VOC
Develop Emerging
Project
Sensors
S66(a)
technology
Technologies
S66(d)
S66(b)
S66(c)
POU Abatement
Strategy for
Lithography
200-001
34
1994 Accomplishments:
1.
Conducted a one-day workshop to share common scrubber issues.
Topics such as packing density, height, damper positions, transport
phenomena, and maintenance were discussed.
2.
Measured performance of six VOC abatement devices using GC/FID and
FTIR techniques. Completed the research and compilation of pollution
prevention/emissions reduction techniques for the industry.
3.
Completed CRADA agreement between NREL and SEMATECH. NREL
completed the assembly of the PCO test unit under a joint CRADA with
SEMATECH.
4.
Completed benchmark study of emissions monitoring devices.
Partnerships:
S66a -
Wet Scrubber Project -- The selected supplier has subcontracted
process modeling to Brookhaven National Lab
S66c -
Developing Emerging Technologies Project -- SEMATECH has a
CRADA with NREL on a cost share basis.
Terminology:
CoO
cost of ownership
CRADA
Cooperative Research & Development Agreement
FTIR
fourier transform infrared
GC/FID
gas chromatograph/flame ionization detector
NREL
National Renewable Energy Laboratory
PCO
photocatalytic oxidation technology
VOC
volatile organic compound
35
S67: RISK ASSESSMENT METHODOLOGY
ROADMAP ALIGNMENT
Technology
0.35pm
0.25pm
0.18pm
0.12pm
0.10pm
0.08pm
Element
1995
1998
2001
2004
2007
2010
Cost of
Use Cost Model to drive toward low cost process, tool, factory,
Ownership
DFESH solutions
Energy/
water use;
Model
Cost/m2 of Si
Model
Incorp.
36
applied to
DFESH
Full Cost Accouting
processed
completed
chemicals
tools into
dev/pkg
Risk
Provide for systematic, data driven ESH decision making
Assessment
Incorporate tool into dev/pkg/proc/tool/facility
Chemical
Chemical
Relative Risk
Incorporation of DFESH tools into
Model
Analysis
Calculation
dev/pkg/proc/tool/facility
Completed
Completed
PROJECT: S67 RISK ASSESSMENT METHODOLOGY AND ESH COST OF
OWNERSHIP AND RETURN ON INVESTMENT
Project Dates:
September 1993-May 1995
Project Background:
There are very few comprehensive environment, safety and health risk models
for use in selecting chemicals to be used in semiconductor manufacturing.
There are also no ESH cost of ownership accounting systems. Although some
European countries have initiated some programs, most of them are in their
developmental stages.
Objective:
S67a - Develop a decision methodology for relative risk assessment of
hazardous materials based on ESH considerations. This tool will:
1.
Evaluate the risk of process/material alternatives for the semiconductor
industry.
2.
Communicate risk decisions to users.
3.
Address management cost/benefit issues.
S67b - ESH CoO/ROI Develop a two-phased model for understanding the
economic impact that ESH costs have on manufacturing productivity. The
model's two major elements consist of:
1.
Identifying calculating cost factors associated with ESH practice.
2.
Converting cost information into a meaningful model.
Tasks:
S67a - Risk Assessment Methodology
No.
Milestone
1.
Benchmark available models/systems
2.
Develop template framework for risk methodology
3.
Complete computerized software tool
4.
Conduct beta/validation test
5.
Compile and document finished tool
6.
Conduct ESH risk tool training
37
S67b - ESH Cost of Ownership and Return on Investment Cost Model
No.
Milestone
1.
Conduct literature review of ESH cost determinants
2.
Identify cost factors
3.
Estimate cost factors
4.
Conduct beta-site testing
5.
Develop final model
6.
Incorporate prototype model into SEMATECH CoO
1994 Accomplishments:
S67a -
1.
A Benchmarking Summary Report which described the attributes of each
software tool identified was accomplished. The report included an
analysis of the software tool's functional capabilities, user interface,
software capabilities and hardware requirements.
2.
A draft template framework for the software tool was completed. The
report's purpose was to describe the characteristics of the software tool.
Also, the major software components used both to specify the system
architecture, and to track specific requirements are presented in this
document.
3.
The comprehensive template's purpose was to provide a complete
flowchart and logic description of the computerized risk methodology tool.
This template provided a detailed description of the screen and report
formats proposed for CARRI, as well as the proposed risk and hazard
elements. A set of algorithms for determining the exposure, hazard, and
relative risk of various processes used in the semiconductor industry was
presented, along with a listing of the processes and chemicals which
were proposed for the standard version of the software.
S67b -
1.
A review of the literature assessing Environmental Safety and Health
(ESH) cost factor identification-estimation-accounting literature published
since 1985 was accomplished. The objectives of this report were to
explain how ESH CoO/ROI modeling was grounded in past research and
provided the framework for understanding factors that drive ESH costs
and ways for accounting for these costs.
2.
An ESH cost factor triangle (organizational hierarchy) and a conceptional
framework for understanding factors that drive ESH costs were
completed.
38
Partnerships:
Sandia National Laboratories shared the methodology of their Eco-Sys risk
model.
Terminology:
CARRI
Computerized Assessment of Relative Risk Inventory
CoO
cost of ownership
EORM
Environmental Occupational Risk Management
PTAB
Project Technical Advisory Board
ROI
return on investment
39
S68 PROCESS BY-PRODUCTS CHARACTERIZATION
ROADMAP ALIGNMENT
Technology
0.35pm
0.25pm
0.18pm
0.12pm
0.10pm
0.08pm
Element
1995
1998
2001
2004
2007
2010
On key
By-products
etch
On all
Incorporate DFESH tools into
analysis
and
tools
dev/pkg/proc/tool/facility
CVD
40
S68
Methodology
Development
S68 Process
Characterized
In R&D
In Use
PROJECT: S68 CHARACTERIZE PROCESS BY-PRODUCTS
Project Dates:
May 1994-October 1995
Project Background:
Some chemicals used in semiconductor manufacturing are transformed into by-
products during processing. The identity of these compounds has not been
verified, making mass balance difficult to perform. Furthermore, the positive
identity of these chemicals aids in the proper selection of personal protective
equipment and waste treatment.
Objective:
Use mass spectrometry and FTIR to analyze etch and CVD by-products in the
reaction chambers, pre- and post-pumps, in pump fluids, and pre- and post-
abatement units. Develop sampling and analytical plans for future analyses.
Collect information in a database.
SAMPLING PLAN (TOOL)
Abatement
Exhaust
B
IN
E
Tool
Pump
A
D
C
Chamber
A
(chamber air and particulates during
preventive maintenance)
Pump
(Before)
B
(pump foreline)
(After)
C
(pump exhaust)
(Itself)
D
(pump fluid and residual particulates)
Exhaust (Before) E (emission and waste)
41
Tasks:
1.
Conduct literature search for previous studies.
2.
Develop sampling and analytical plans.
3.
Analyze and quantify the by-products up to 95% mass balance for metal,
poly, nitride, oxide and tungsten, TEOS and nitride CVD processes.
1994 Accomplishments:
1.
Obtained qualitative results for eight pieces of etch and CVD equipment.
Carbonyl fluoride, which was not previously predicted, was identified
during plasma cleaning. This chemical is highly water soluble and easily
removed through the scrubbing process.
2.
Completed instrument calibration for 24 compounds.
3.
Completed draft sampling and analytical plan.
4.
Literature search identified some metal etch by-products and pump fluid
contaminants.
Terminology:
CVD
chemical vapor deposition
FTIR
fourier transform infrared
TEOS
tetraethylorthosilicate
42
S69: REDUCE GLOBAL WARMING
ROADMAP ALIGNMENT
Technology
0.35pm
0.25µm
0.18pm
0.12pm
0.10pm
0.08pm
Element
1995
1998
2001
2004
2007
2010
Hazardous
Chemical Use
Reduce use and waste at point of use through
Reduction
Alternative
Perfluoro
Reduce emissions
Compounds
to 1990 levels
compounds
available
44
Combustion
Thermal/
Chemical
S69 Technology
Development
Plasma
Recovery/Recycle
Alternative
Chemistries
IN R&D
IN USE
PROJECT: S69 REDUCTION OF GLOBAL WARMING AGENTS
Project Dates:
January 6, 1994-August 31, 1995
Project Background:
The perfluoro compounds (PFCs), such as CF₄, C₂F₆, NF₃ and SF₆, used in the
plasma etch and CVD chamber cleaning processes are very stable and strong
infrared absorbing chemicals. This makes them excellent greenhouse gases
and potential contributors to global warming, and consequently subjects them to
the EPA's Climate Change initiatives.
This project has embarked on a mission to communicate this issue to all parties
concerned, to develop a PFC information data base, and to evaluate the
alternatives for reducing the use as well as the emissions of these gases to the
atmosphere.
Objective:
To evaluate and encourage the emerging technological options for reducing the
use and emissions of PFCs to the atmosphere. Options include alternative
chemistries, process optimization, recovery/recycle, combustion, plasma
destruction and chemical/thermal reaction.
Project Strategy
Chemical
Data Gathering
Alternatives
&
Global
Communication
Process
Warming
Optimization
Gas
Reduction
Destruction
Decomposition
Recovery
& Recycle
Thermal/
Combustion
Plasma
Chemical *
Current Contracts
* Proposal under development
45
Tasks:
1.
Develop a U.S. semiconductor industry PFC use/emissions baseline.
2.
Collect, analyze and summarize all existing PFC abatement device data.
3.
Construct a computer model for evaluating the net global warming
benefit, considering all direct and indirect effects, of an abatement
device.
4.
Develop a generic sampling/test plan to make future abatement device
evaluations more comprehensive, comparable and statistically
meaningful.
5.
Evaluate a combustion unit from a supplier on a process tool in terms of
PFC destruction efficiency, cost of ownership and by-products of
combustion.
6.
Evaluate a combustion unit from a supplier which is being developed to
handle solids-laden PFC emissions.
7.
Search for replacement chemicals for use in etch and CVD chamber
clean processes.
8.
Study the kinetics of PFC break down in plasmas to improve PFC
conversion in process tools as well as abatement devices.
1994 Accomplishments:
1.
SEMATECH sponsored a two-day global warming conference attended
by 100 plus representatives from the equipment suppliers, gas suppliers,
abatement device manufacturers, microchip manufacturers, EPA and
academia.
2.
Issued interim report for the beta-site evaluation of one of the
combustion units presenting the results for the three-week intensive
testing.
3.
Made a presentation of the PFC issue and the technology alternatives for
dealing with the problem at a SEMATECH-sponsored equipment
engineering workshop and a SEMI/SEMATECH-sponsored Process Tool
Suppliers meeting.
4.
Completed global warming net benefit model and generic sampling/test
plan.
46
5.
Completed draft report of abatement device data summary.
6.
Issued a white paper on global warming as it impacts the semiconductor
industry. SEMATECH document 93112074A-TR.
Partnerships:
1.
Developed the scope for two, multi-year, university research efforts --
one on a study of PFC kinetics in plasmas and one on alternative etch
chemicals. MIT was selected to do this research.
2.
Signed agreement with Semiconductor Research Corporation (SRC) to
manage these two university contracts for SEMATECH.
3.
Continued to work with EPA's Climate Change Division to supply
technical and cost data for further discussion on the issues.
Terminology:
EPA
Environmental Protection Agency
MIT
Massachusetts Institute of Technology
PFCs
perfluoro compounds
CVD
chemical vapor deposition
SRC
Semiconductor Research Corporation
47
S70: DESIGN FOR ENVIRONMENT, SAFETY & HEALTH
ROADMAP ALIGNMENT
Technology
0.35pm
0.25pm
0.18pm
0.12pm
0.10pm
0.08pm
Element
1995
1998
2001
2004
2007
2010
Tool and Factory
Develop mass balance to allow for identification of risks and
Mass Balance
improvements in process, tool, and factory design
Use Cost Model to drive toward low-cost process, tool, factory,
Cost of Ownership
DFESH solutions
Risk Assessment
48
Provide for systematic, data driven ESH decision making
Hazardous
Reduce use and waste at the point of use through process
Chemical Use
Reduction/m²Si
efficiency, reuse, substitution, additive technologies, etc.
Emissions
Use abatement to reduce emissions, as necessary, until source
Reduction
reductions take effect
Energy/Water
Reduce natural resources required to produce a wafer
Reduction
Worker Protection/
Continuous improvement of worker protection and drive toward
Ergonomics
elimination of stress factors, accidents, and injuries
PROJECT: S70 DESIGN FOR ENVIRONMENT, SAFETY AND HEALTH
Project Dates:
May 1994-May 1996
Project Background:
There are no comprehensive Design for Environment, Safety and Health tools
to help industries integrate ESH with R&D and manufacturing processes.
Objectives:
1.
Develop a semiconductor industry Design for Environment, Safety and
Health strategy.
2.
Determine a set of semiconductor industry metrics and provide an
assessment of the current state of the industry.
3.
Develop a tool and factory materials/energy balance and incorporate it
into a software tool.
4.
Create DFESH training and communications tools to educate member
company and suppliers on DFESH and how to integrate it into their
business culture.
SCOPE
Device
Design
Remanufacturing
Fugitive and untreated residuals
Closed-toop
Manufacture
recycling
Airborne, waterborne, and
& Assembly
solid residuals
Recycling
Material, energy, and labor
inputs for Process and
Engineering
Use &
Reuse
Management
& Specially
Service
Materials
Transfer of materials
between stages for
Product; includes
Bulk
Retirement
transportation and
Processing
packaging (Distribution)
Open-loop
recycling
Material
Raw Material
Treatment
downcycling
Acquisition
Disposal
into another
product
system
The Earth and Biosphere
Source: Life Cycle Design
Guidance Manual FPA/600/R-92/226
49
Tasks:
Objective 1
-
White paper report on DFESH in semiconductor industry
-
DFESH tool matrix
-
DFESH areas of opportunity report
-
Final report with DFESH strategy
Objective 2
-
Set of metrics
-
Final report with current state of industry
Objective 3
-
Survey of existing modeling, data collection, and software methodologies
-
Model
-
Software tool
-
Evaluation criteria report & reliability plan
-
Beta-site testing/reliability report
-
Final software tool
-
Software training program
-
Maintenance and distribution plan
Objective 4
-
Management training module
-
R&D and manufacturing training module
-
Supply & procurement training module
-
Supplier training module
-
Final training package
1994 Accomplishments:
1.
A supplier has been selected. Negotiations are proceeding.
2.
CRADA negotiations have been initiated with Los Alamos National
Laboratories.
Terminology:
R&D
research and development
CRADA
Cooperative Research and Development Agreement
DFESH
Design for Environment, Safety and Health
50
PROJECT: S71 SILANE SAFETY IMPROVEMENT
Project Dates:
November 1993-June 1994
Project Background:
Silane is a key source of material for silicon deposition in silicon chips. The cost
of ownership for the use of and the incidents resulting from silane is estimated
to be high. Further, many different methods for controlling the hazards of silane
are used.
Objective:
Survey silane users to benchmark silane engineering controls and incident data.
The project also attempted to identify a less hazardous material to replace
silane.
Tasks:
1.
Survey silane users, producers and distributors to benchmark common
engineering control practices and identify effective practices.
2.
Survey silane users, producers and distributors to assess the risks
associated with silane use and to document silane incidents, including
costs and injuries.
3.
Identify a silane replacement strategy that shows the highest probability
of successful development.
4.
Determine if replacing silane for silicon deposition is necessary and if
there is a viable path toward replacement.
1994 Accomplishments:
1.
Completed the project on time and within budget.
2.
Identified numerous noteworthy practices utilized by different industries,
to reduce the cost and severity of the incidents.
3.
Identified potential opportunities in the point-of-use hydride technology for
silane delivery.
4.
Conducted a Silane Safety Workshop which was well attended.
Tech Transfer Reports:
94062405A-ENG Silane Safety Improvement Project, S71 Final Report
51
PROJECT: S116 PROCESS WATER RECYCLING
Project Dates:
June 1994-December 1995
Project Background:
A:
The semiconductor manufacturing community is committed to decreasing the
amount of water consumed to support the manufacture of wafer devices. In
March 1994, in cooperation with SIA and SSA (Semiconductor Safety
Association), SEMATECH sponsored an international symposium of water
management and conservation in the semiconductor industry. A total of more
than 130 representatives from the United States, Europe and Japan participated
in this effort to share information on related technologies and strategies. It was
the consensus of those in attendance that a joint approach was the most
effective way to expedite technological advancement in water conservation and
that advances in this area had a universal benefit. For this reason, information
should be generously shared and built upon. A commitment was made to
continue communication on this subject to ensure a coordinated research effort.
B.
At present there is no comprehensive decision-making tool to characterize the
consumption and disposal of water throughout the facility. A water balance
model tool would facilitate the analysis of current site water/wastewater flow
and allow users to evaluate the overall impact of implementation of water
conservation strategies.
C.
State-of-the-art sensors for total organics in ultrapure water systems are
inadequate for the real-time detection of organic contaminants specific to
process water recycle systems. This limitation impacts both the design and
control of recycle systems, allowing certain undesirable organics to pass
through the recycle system, increasing the risk of wafer contamination during
the rinse process.
D:
The chemical processes associated with recycle water purification systems are
not well characterized. Research into the basic chemical processes utilized in
purification systems will identify opportunities for the optimization of current
technology and development of new technologies for recycle purification
systems.
Objectives:
1.
Develop an integrated water conservation program to promote common
program goals and minimize redundancy in research and development.
2.
Develop a decision methodology for the characterization of current
industry water/wastewater systems and evaluate the impact of water
conservation measures.
53
3.
Provide in-situ realtime sensor technology for the analysis of organic
contaminants in process water recycle systems.
4.
Coordinate with universities, national labs and suppliers to promote the
development of cost-effective technologies to optimize recycle purification
systems.
Tasks:
1.
Survey semiconductor industry to benchmark current water conservation
practices and determine future requirements. Coordinate with major
academic and industrial contributors to develop a integrated industry
strategy to reduce water consumption. Strategy will encompass
fabrication equipment & process optimization as well as process water
recycle and reclaim strategies.
2.
Develop a comprehensive decision support tool to characterize water use
and disposal in a semiconductor facility. Perform system analysis on
typical semiconductor facility to evaluate water usage/ wastewater
generation at the tool, system and factory level. Develop prototype model
for beta-site testing, revise and develop interface to produce final
software tool.
3.
Determine specifications for organic sensors for use in process water
recycle systems. Assess the current status of organic sensor technology
in both market and research sectors. Benchmark performance and cost
of available sensor technologies and feasibility of current sensor research
projects.
4.
Develop optimum control strategies for recycle systems, characterize
chemical balance for current recycle purification processes and identify
opportunities for new purification technologies.
1994 Accomplishments:
1.
Completed benchmark survey to review current status and future
requirements in water conservation. Preliminary evaluation of survey data
indicates technology gaps in the area of wafer rinse process
optimization, recycle sensor technology and recycle purification
processes.
2.
Developed water conservation program to promote common industry
focus and integrate current activities in the area of water conservation.
Established core team of investigators and contributors, first team
meeting to be held in Q1- 1995.
54
3.
Coordinated with the working groups of the National Technology
Roadmap for Semiconductors and member technical community to
generate common industry goals and metrics.
4.
Developed a prototype cost model to provide the industry with a standard
for calculating the cost of Ultrapure water used in the wafer rinse
process. Cost standard will standardize the cost assessment of water
conservation strategies.
55
National Technology Roadmap
for Semiconductors
(ESH Section)
5
57
5
NATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS
(ESH SECTION)
The SEMATECH ESH staff was instrumental in updating the ESH section of the
National Technology Roadmap for Semiconductors. This included ESH Director
H. Ray Kerby serving as co-chair of the Technical Working Group and
coordinating meetings and input from industry, suppliers and academia
throughout the year.
The ESH portion of the roadmap has been reprinted in the following section.
59
66
Environment, Safety, and Health
ENVIRONMENT, SAFETY, AND HEALTH
In the last 20 years, the semiconductor industry has played a pivotal role in developing
technology to improve the environment. Millions of trees have been saved as computer
chips enabled businesses to operate with electronic mail and paperless factories. Computer
chips in teleconferencing systems, modems, and fax machines have saved millions of travel
miles which, in turn, has lessened air pollution. Most of the cars on the road today have
electronic control systems making them more fuel efficient and less polluting. Radar sys-
tems heralding early storm warnings have saved thousands of lives and given emergency
agencies time to protect homes and the environment. Each generation of smaller, faster
computer chips uses less power, which contributes toward U.S. industry's management of
energy resources. And the industry uses more efficient production techniques and pro-
cesses, reducing waste generation.
To ensure this trend continues, the semiconductor industry has collaborated on an aggres-
sive plan to manage complex environmental issues related to technology development. The
goal is to design and manufacture each new generation of chips by using less chemicals,
water, and energy, and by generating less waste.
SCOPE
There are many driving forces for change in Environment, Safety, and Health (ESH)
technology. Paramount is the long-standing industry commitment for continuous improve-
ment in ESH performance based on identified need and cost-effective technology solutions.
Key external driving forces include the following:
The command and control regulations at all levels of government will continue and
increase while there will be a relative increase in voluntary and incentive-based
programs.
The realities of cost and relative risk improvement will be used more than in the past
at all levels of decision making.
Nontraditional factors will become more influential, such as more public-disclosure
types of regulations, environmental equity, community-based concerns, international
environmental and market-driven requirements, and total life-cycle concerns.
The scope and needs in this roadmap are aimed at developing a timely technology-based
response to the driving forces.
This ESH Technology Working Group (TWG) report covers the focus areas shown in Figure
11. This report treats both the semiconductor wafer fabrication facility and the semiconduc-
tor assembly and test facility as synonymous. Inputs to either facility are chemicals,
energy, and water, and worker protection planning and implementation (including ergo-
nomics). Ergonomics broadly covers the person/machine/facility interaction for safety.
"Worker protection" refers to reducing risk to employees from potentially harmful physical
and chemical agents. Outputs of the facility are the controlled emissions that are channeled
to exhaust and waste handling systems and the fugitive emissions that escape from either
production tools or the chemical supply system.
61
Environment, Safety, and Health
67
Energy/Water
Worker Protection/
Reduction
Ergonomics
Hazardous
Chip Fabrication, Assembly,
Chemical Use
Emissions
and Test
Reduction
Reductions
Design for ESH Tools:
- Chemical, Energy, and Water Mass Balance
- Cost of Ownership
- Risk Assessment
Figure 11 Environment, Safety, and Health Technology Focus Areas
Tools to support the management of the input to and output from a facility are also shown
in Figure 11. Chemical, energy, and water mass balance will support reducing chemicals
and effluent, and sizing facility exhaust and waste handling systems. Cost of ownership
(CoO) includes the purchase, use, management, disposal, and liability costs. Risk assess-
ment indicates the relative risk of hazardous materials based on ESH considerations.
These tools are critical to an overall design for environment, safety, and health methodol-
ogy by which ESH considerations and constraints can be integrated with process and
product design.
CURRENT TECHNOLOGY STATUS
The semiconductor industry has achieved many ESH successes, such as maintaining low
rates of injury and illness, reprocessing acids, reducing use of potentially hazardous mate-
rials and ozone-depleting substances, developing tool and facility safety standards,
implementing process hazard reduction programs, and instituting voluntary chemical
phase-out programs. However, more programs need to be identified, prioritized, and imple-
mented.
Figure 12 shows that some progress beyond the 0.50 µm technology level is being made in
hazardous chemical use reduction, reduced emissions, and tool and factory mass balance.
Very little progress has been made beyond the 0.50 um technology level with regard to CoO,
hazardous chemical risk assessment, and ergonomics. Currently, ESH costs are typically
buried in facilities or overhead costs. The ergonomic design is basically the same for both
0.35 um and 0.50 um facilities. Ergonomic design requirements for process tools and wafer
handling systems will be driven by increasing wafer size rather than by decreasing fea-
ture size.
Tool and factory mass balance, as well as improvements in emissions monitoring, are being
driven by the national Clean Air Act amendments and local permitting authorities. The
other driver is the economic need to more accurately size facilities' exhaust and waste
treatment systems. Equipment suppliers are being requested to provide mass balance
analysis of the 0.50 µm and 0.35 um processes that run on their tools. Tool-resident, real-
time mass balance analysis that is accessible by the factory computer-integrated
manufacturing (CIM) system is not a standard feature for 0.50 and 0.35 um tools.
62
68
Environment, Safety, and Health
Hazardous Chemical Use Reduction
0.10
Worker Protection/Ergonomics
Emissions Reduction
0.10
0.10
Risk Assessment
Tool and Factory
Mass Balance
0.10
0.10
0.13 um
0.18 um
0.25 um
0.35 um
0.50 um
0.10
0.10
Cost of Ownership
Energy/Water Reduction
Production Use IS defined as the technology used in the produc-
Concept Demonstrated is defined as a technology that has been
tion of semiconductors for commercial sales.
demonstrated to work but has not been fully characterized.
R&D Use is defined as technology that is used for integrated pro-
Concept Development is defined as a technology that has been
cess development or product design or is otherwise available for
proposed but not demonstrated that has the potential to solve the
next-generation production without further development
stated need.
Figure 12 Environment, Safety, and Health Performance Envelope
Significant progress is being made in reducing the use of hazardous chemicals. Ozone-
depleting substances (ODS) and targeted ethylene glycol ethers (EGE) are rapidly disap-
pearing from semiconductor wafer manufacturing and assembly processes. Alternative
chemicals and safer delivery methods are being sought for silane, dopants, and hazardous
solvents and degreasers used in equipment cleaning and product assembly processes.
Emission abatement technology, process optimization, and replacement chemicals are
needed for atmospherically long-lived process gases, such as perfluoro compounds.
Advanced wafer cleaning methods that use either significantly less chemicals or none at all
have been demonstrated, although much research is still needed.
There is room for significant improvement in energy consumption per m² of silicon wafer
processed. Equipment manufacturers generally do not hear this as a significant customer
requirement, so there is no significant development of energy-saving technology underway.
The cost of energy and the debate of the effects of CO₂ generation on global warming are
motivating improvements beyond current levels.
63
69
Water consumption per m² of silicon processed continues to increase with each technology
generation. Water costs, water availability, and community concerns drive the need to
conserve water. Efficient use of water in processes and cost-effective recycling of ultrapure
water in facilities are strategic needs that require more emphasis.
Online, continuous personal exposure sensors with instantaneous readouts and 99% accu-
racy are not available for practical use. To isolate human contamination, workers must
wear cleanroom garments that may contribute to stress. There is increased attention to
ergonomic designs to further protect equipment maintenance workers.
ROADMAP OF TECHNOLOGY NEEDS
The ESH roadmap of needs is shown in Table 10. The strategic intent is to integrate
preventive ESH solutions into process, equipment, and facility engineering. A comprehen-
sive design for environment, safety, health (DFESH) paradigm shift will take place when
utilizing the tools and technology developments on the roadmap.
64
The National Technology Roadmap for Semiconductors
Table 10 Environment, Safety, and Health Technology Requirements
1995
1998
2001
2004
2007
2010
70 Environment, Safety, and Health
0.35 µm
0.25 µm
0.18 µm
0.13 µm
0.10 µm
0.07 µm
Design for Environment, Safety, and Health Paradigm Shift
ESH Community Ownership
Factory/Supplier Ownership
Mostly End-of-Pipe Hazardous
Chemical Emissions Abatement
Use Reduction
Tool and Factory Mass
Balance
Develop mass balance to allow for identification of risks and improvements in process, tool, and factory design.
Models available
On key tools
On all tools and factories
On key etch and CVD
By-products analysis
On all tools
tools
Incorporate DFESH tools into development/packaging/process/tool/facility
65
Mass balance
Tool suppliers provide
Online reporting and
data
Incorporate DFESH tools into development/packaging/proces/tool/facility
analysis
Cost Of Ownership
Use cost model to drive toward low-cost process, tool, factory, DFESH solutions.
Energy/water use;
Cost/m² of
Model completed
Model applied to
Incorporate DFESH
tools into
Si processed
chemicals
Full Cost accounting
development/packaging/
process/tool/facility
Risk Assessment
Provide for systematic, data-driven ESH decision making.
Relative Risk
Chemical model
Chemical analysis
calculation
completed
Incorporate DFESH tools into development/packaging/process/tool/facility
completed
Table 10 continued Environment, Safety, and Health Technology Requirements
1995
1998
2001
2004
2007
2010
0.35 µm
0.25 um
0.18 µm
0.13 µm
0.10 µm
0.07 µm
Hazardous Chemical
Use Reduction / m² Si
Reduce use and waste at the point of use through process efficiency, reuse, substitution, additive technologies, etc.
Ozone Depleting
Substance Use
Total phase out
in Process
Targeted Ethylene
Total phase out
Glycol Ethers
Chemical List A
Decrease 50% from 1988
(Focused Use
Cyanide-free plating
Pb-free solder systems
Additive processes
use
Reduction List)
Chemical List B
(General Release,
No-clean technologies for
< Reportable limits or
50% of 1988 use
< Reportable limits or 25% of 1988 use
Disposal List)
packaging
Additive processes
Reduce / m² Si
Chemical List C
66
(Focused Air
Reduce 50% from 1988 use or below permit triggers
Additive processes
Emissions List)
Reduce / m² Si
Perfluoro Compounds
Source reduce to 1990 emission levels by 2000
Non-perfluoro compound available
Hydrides
Safest practice implementation
Point-of-use generation
Safe alternatives available
Replace thermoset with
Plastics
thermoplastic packaging
Nontoxic flame retardants in packaging
The National Technology Roadmap for Semiconductors
Environment, Safety, and Health 71
The National Technology Roadmap for Semiconductors
Table 10 continued Environment, Safety, and Health Technology Requirements
1995
1998
2001
2004
2007
2010
72 Environment, Safety, and Health
0.35 µm
0.25 µm
0.18 µm
0.13 µm
0.10 µm
0.07 µm
Emissions Reduction
Use abatement to reduce emissions, as necessary, until source reductions take effect
Chemical List A
(Focused Use
Decrease 50% from 1988 emissions
Cyanide-free plating
Reduction List)
Chemical List B
(General Release,
Reduce 80% from 1988 emissions
Disposal List)
Reduce / m² Si
Chemical List C
(Focused Air
Reduce 80% from 1988 emissions or below permit triggers
Emissions Liet)
67
Reduce/m² Si
Perfluoro Compounds
< 1990 emission levels in 2000
Energy/Water
Reduce natural resources required to produce wafers and devices
Reduction
Water (gal/m² of Si)
Decrease 50% from 1988 usage
Energy (Jou/m² of Si)
No increase from 1993
Reduce by 10% overall from 1993
Reduce by 50% overall from 1993
Worker Protection/
Continue improving worker protection and drive toward eliminating stress factors, accidents, and injuries
Ergonomics
Eliminate reliance on
Reduce reliance on garments to isolate people from
garments to isolate
Ergonomics
SEMI tool interface ergonomics guidelines
processes/product in new facilities
people from
processes/product in new
facilities
Process worker isolation
from hazardous
Worker Protection
materials
Online, realtime monitoring of worker exposures
All liquid cleans in 100%
enclosed tools
Environment, Safety, and Health
73
LIST A (FOCUSED USE REDUCTION LIST)
Benzene
Methyl Ethyl Ketone
Cadmium and Cadmium Compounds
Methylene Chloride (Dichloromethane)
Carbon Tetrachloride
Nickel and Nickel Compounds
Chloroform (Trichloromethane)
Tetrachloroethylene (Perchloroethylene)
Chromium and Chromium Compounds
Toluene
Cyanide Compounds and Hydrogen Cyanide
Lead and Lead Compounds
1,1,1 Trichloroethane (Methyl Chloroform)
Mercury and Mercury Compounds
Trichloroethylene
Methyl Isobutyl Ketone
Xylenes (All Isomers)
LIST B (GENERAL RELEASE, DISPOSAL LIST)
1,1,1 Trichloroethane (Methyl Chloroform)
Methanol
1,2 Dichlorobenzene
Methyl Ethyl Ketone
1,2,4 Trichlorobenzene
Methyl Isobutyl Ketone
Acetone
Methylene Chloride (Dichloromethane)
Ammonia
N-Butyl Alcohol
Ammonium Nitrate (Solution)
Nickel Compounds
Ammonium Sulfate (Solution)
Nitric Acid
Copper
Phenol
Copper Compounds
Phosphoric Acid
Ethylbenzene
Sulfuric Acid
Ethylene Glycol
Freon 113
Tetrachloroethylene (Perchloroethylene)
Glycol Ethers
Toluene
Hydrochloric Acid
Trichloroethylene
Hydrogen Fluoride
Trichlorofluoromethane
Lead
Xylene (Mixed Isomers)
LIST C (FOCUSED AIR EMISSIONS LIST)
1,1,1 Trichloroethane (Methyl Chloroform)
Glycol Ethers
1,4 Dichlorobenzene
Hydrochloric Acid
1,2,4 Trichlorobenzene
Hydrofluoric Acid
1,3 Butadiene
Hydroquinone
1,4 Dioxane
Isopropyl Alcohol
Acetonitrile
Lead Compounds
Antimony Compounds
Methanol
Arsenic (Arsine)
Methyl Isobutyl Ketone
Compounds
Methyl Ethyl Ketone
Carbon Tetrachloride
Methyl Tert Butyl Ether
Catechol
Methyl Methacrylate
Chlorine
Methyl Chloride
Chlorobenzene
Methylene Chloride (Dichloromethane)
Chloroform (Trichloromethane)
Chromium Compounds
Nickel Compounds
Phenol
Cobalt Compounds
Cresols/Cresylic Acid
Phosphine
Cyanide Compounds
Phosphorus
Diborane
Tetrachloroethylene (Perchloroethylene)
Dimethyl formamide
Toluene
Ethyl Benzene
Trichloroethylene (TCE)
Ethylene Glycol
Xylenes
68
74
Environment, Safety, and Health
TOOL AND FACTORY MASS BALANCE
The factory mass balance tool will provide the database and insight needed for tracking and
improving chemical and natural resource consumption. Online information on all tools will
benefit both process and ESH management. For example, there is now an effort that will
develop the methodology for determining the by-products of a process. This methodology
will be used initially on representative etch and chemical vapor deposition (CVD) tools.
Process tool suppliers and users need to aggressively use this methodology for existing and
new tools until the by-products are understood.
When the mass balance models and the by-products analysis methodologies have matured,
they need to be incorporated into the tools along with chemical volume input monitoring.
This will provide automatic realtime mass balance data that can be accessed by the factory
CIM system. CIM systems should have the capability to generate a total factory mass
balance analysis for chemicals, energy, and water using the mass balance input from each
tool.
COST OF OWNERSHIP/RISK ASSESSMENT
A cost of ownership tool is needed to understand all elements of cost and ultimately manage
ESH total cost as a business cost element.
Risk assessment methodology will allow total risk comparisons of alternative chemicals
and implementation schemes. Initial work in this area is underway to adapt a scientific
methodology for the semiconductor industry.
HAZARDOUS CHEMICAL USE REDUCTION
The hazardous chemical use reduction needs are tailored to eight groups of chemicals (see
Lists A, B, and C on page 73). Past industry efforts to eliminate ozone-depleting substances
and target ethylene glycol ethers have dramatically reduced the use of these chemicals and
will lead to their total phase out in the near future. The Potential Solution section enumer-
ates possible ways other chemical use can be reduced or managed, but there is much room
for innovation. Point-of-use (POU) chemical generation could also result in chemical use
and possible hazard reduction.
List A chemicals have technical Roadmap focus because of their significant emission,
disposal, and hazard characteristics. The goal for some chemicals on List A continues
beyond the voluntary effort many industry companies now have underway. List B contains
the chemicals used in the industry in larger quantity, which need technical roadmap focus
because of their emission, disposal, and associated hazard challenges. List C contains
materials that need technology focus because of their air emission characteristics.
These lists are subject to change throughout the Roadmap period. They were developed as
part of the National Roadmap work and are intended to provide specificity for the broad
range of R&D activities that will reduce use. For example, reducing chemical use and
optimizing processes should be the primary direction for R&D programs. Until the use
reduction results take effect, a secondary approach would be using abatement systems
sized for single or multiple tools to reduce emissions of compounds from Lists A, B, and C.
The industry goal should be to achieve very low (approaching zero) air pollutant emissions
and benign emissions of the toxic chemicals. New wafer cleaning methods that use either
dilute chemistries or no liquid chemicals need to be developed for 0.18 µm/2001 and follow-
on technology levels. Also, in 0.07 µm/2010, additive processes need to be implemented.
69
Environment, Safety, and Health
75
In the global scheme, perfluoro compounds emissions of the industry are a very small
potential contributor to possible global warming. However, the industry supports the need
to actively pursue effective abatement, reduced usage, and possible long-range alterna-
tives. Hydrides, including silane, need "safe-use" technology and management, since they
are critical materials to the industry. Safe alternatives will require significant research if
the hydrides are ever to be totally replaced.
EMISSIONS REDUCTION
Emissions reduction, especially during the first half of the Roadmap period, depends upon
cost-effective tactical abatement technology to complement chemical use reduction of the
materials discussed above.
ENERGY/WATER REDUCTION
Energy and water reduction programs need both a short- and a long-term focus. Cost-
effective water use reduction through process and tool design changes and recycling
systems needs to be developed and put in place for the industry to achieve a 50% reduction
in 0.25 µm factories. The consideration for minimizing water consumption needs to occur
during process and tool development. The energy level per wafer required by a next-gen-
eration tool should be an important cost and conservation consideration. The goal should
be to either maintain it at the same level or decrease it through 1998. Later in the
Roadmap period, facilities should be more energy-efficient, leading to overall energy sav-
ings goals of 10% by 0.18 µm/2001 and 50% by 0.10 µm/2007 from 1993 baseline levels.
WORKER PROTECTION/ERGONOMICS
Workers will be better protected through chemical and physical hazard management, but
other opportunities exist as well. Ergonomics, in a broad sense, is important for health and
safety. Ergonomics drives the need for automated handling of larger wafers. Emphasis is
needed on safe maintenance processes for enclosed tools and minienvironments. The indus-
try needs to continue improving the quality of the work environment, so that the need for
personal protective equipment and special garments is minimized. The technology of expo-
sure monitoring of workers should progress to allow for online, realtime measurements.
SEMI ESH guidelines should be developed and updated as technology evolves. Also, the
move to POU chemical generation and POU abatement systems could result in a more
chemically-safe environment.
POTENTIAL SOLUTIONS
As indicated in Table 11, the potential ESH needs and solutions impact other TWG technol-
ogies. Many of the solutions need to be driven within those TWG processes.
70
76
The National Technology Roadmap for Semiconductors
Table 11 Environment, Safety, and Health Potential Solutions
TOOL AND FACTORY
Cost OF OWNERSHIP
RISK ASSESSMENT
HAZARDOUS
EMISSIONS
ENERGY/
WORKER
ELEMENT
Environment, Safety, and Health
MASS BALANCE
CHEMICAL USE
REDUCTION
WATER REDUCTION
PROTECTION/
THRUST
REDUCTION
ERGONOMICS
Design and
Incorporate DFESH AB
Design for low power
Ergonometric design of
Test
part of design
consumption.
ECAD tool physical
constraints.
environment.
ESH
Characterize
Develop ESH cost of
Develop risk
Monitor and advise on
Develop abatement
Monitor energy and
Develop realtime
by-products
ownership.
assessment
hazardous chemical use
technologies.
water reduction
sensors for personal
Develop chemical,
methodology.
reduction progress.
program.
monitors.
energy, and water mass
Improve SEMI S2
balance.
implementation.
Factory
Implement CIM insitu
Use chemical cost of
Complete risk
Reduce chemical use.
Develop abatement
Reduce energy use.
Increase use of
Integration
chemical mass balance.
ownership to select
assessment ranking of
Reduce chemical
technologies.
Recycle, reclaim water.
minlenvironments.
chemicals.
all chemicals.
hazards through
Reduce air
Decrease reliance on
71
improved controls,
requirements for
garments to prevent
warning systems, and
cleanrooms.
contamination
material compatibility.
Develop low pressure
Reprocess chemicals.
gas delivery systems.
Implement automated
wafer handling.
Interconnect
Implement mass
Use chemical cost of
Complete risk
Develop additive
Reduce emissions of
Tool suppliers reduce
Improve equipment
balance on all tools.
ownership to select
assessment ranking of
processes.
perfluoro compounds.
energy use/wafer.
ergonomic design.
Identify and compile all
chemicals.
all chemicals.
Optimize etch processes
Reduce manual
by-products data.
to min. chemical waste.
preventive maintenance
Reduce use of PFCs.
of equipment.
Reprocess chemicals.
Lithography
Implement mass
Use chemical cost of
Complete risk
Develop additive
Reduce solvent
Tool suppliers reduce
Reduce manual
balance on all tools.
ownership to select
assessment ranking of
technologies.
emissions.
ventilation
preventive maintenance
chemicals.
all chemicals.
Use aqueous based litho
requirements of litho
of equipment.
systems.
tracks.
Eliminate odors.
Reduce solvent use in
Improve equipment
processing.
ergonomic design.
Reduce solvent and
heavy metals use in
mask making.
Table 11 continued Environment, Safety, and Health Potential Solutions
TOOL AND FACTORY
COST OF OWNERSHIP
RISK ASSESSMENT
HAZARDOUS
EMISSIONS
ENERGY/
WORKER
ELEMENT
MASS BALANCE
CHRMICAL USE
REDUCTION
WATER REDUCTION
PROTECTION/
THRUST
REDUCTION
ERGONOMICS
Materials
Implement mass
Use chemical cost of
Complete risk
Extend chemical use
Reduce gas and solvent
Tool suppliers reduce
Enclose all liquid-clean
and Bulk
balance on all tools.
ownership to select
assessment ranking of
life.
emissions.
energy use/wafer.
tools.
Processes
Identify and complle all
chemicals.
all chemicals.
Use no-clean
Reduce water usage
Improve equipment
by-products data.
technologies.
thru optimization and
ergonomic design.
Use dilute chemistries.
recirculation.
Optimize processes.
Seek safe alternatives
to hydrides.
Develop additive
processes.
Assembly
Implement mass
Use chemical cost of
Complete risk
Use cyanide-free
Reduce solvent
Reduce energy use to
Improve equipment
and
balance on all tools.
ownership to select
assessment ranking of
plating.
emissions.
manufacture packages.
ergonomic design.
Packaging
Identify and compile all
chemicale.
all chemicals.
Use Pb-free solder
by-products data.
systems.
Reduce solvent use.
Use thermoplastics.
Use nontoxic flame
72
retardants.
Reduce organics in
binders.
Procern
Incorporate DFESH A0
Use chemical cost of
Complete risk
Invent steps that
Ergonometric design of
Integration,
part of design
ownership to select
assessment ranking of
eliminate chemicals and
ECAD physical
Devices, and
constraints.
chemicale.
all chemicals.
cleaning processes.
environment.
Structures
Develop additive
technologies.
The National Technology Roadman for Semiconductors
Environment, Safety, and Health 77
78
Environment, Safety, and Health
PRIORITY/DIFFICULTY OF EFFORTS
The priority of technology needs is shown in Table 12. Each need is designated by either an
R for research or D for development and is timed when the ESH TWG feels that it can be
implemented.
Breakthroughs are needed to find safe hydride alternatives, develop alternative cleaning
processes, and develop additive processes. (Additive processes add material only to selected
areas of the wafer and eliminate or reduce the need for masking, etch, and cleaning.)
Table 12 Priority of Environment, Safety, and Health Technology Needs
HIGH PRIORITY
SECONDARY PRIORITY
0.18 µm/
Cost-effective, reliable, integrated, spe-
Low pressure gas system (R)(D)
2001 Needs
cific chemical sensors (D)
BREAK
0.13 µm/
Alternative cleaning processes (R)
THROUGH
2004 Needs
NEEDED-
SHOW
0.10 µm/
Hydride alternatives (R)
Nonhazardous emission semiconductor
STOPPERS
2007 Needs
manufacturing tool (R)
Perfluoro compound alternatives (R)
Pb-free solder
0.07 um/
Additive process technology (R)
INNOVATION
2010 Needs
NEEDS
0.35 um/
Chemical mass balance and by-products
Risk assessment (D)
1995 Needs
(D)
0.25 µm/
Integrated POU abatement at tool (D)
Cost equivalent ultrapure water recycle
CONCEPTS
1998 Needs
(D)
EXIST, BUT
NEED To
0.13 µm/
Integration of DFESH into semiconduc-
Wafer cleaning without hazardous
BE PROVEN
2004 Needs
tor product design (D)
chemicals. (D)
(R) Research
(D) Development
CROSSCUT TECHNOLOGY NEEDS
The needs for those technologies that are not addressed by a formal TWG are shown in
Table 13. Training/education was added because the ESH TWG felt that to achieve the
requirements roadmap, the level of ESH awareness needed to be raised in all areas of the
semiconductor industry.
If more than one need is shown for a technology, the priority is shown in parentheses, with
1 being the highest priority.
73
Environment, Safety, and Health
79
Table 13 Priority of Environment, Safety, and Health
Crosscut Technology Needs
() = indicates priority
METROLOGY
CONTAMINATION-FREE MANUFACTURING
0.25 µm/
(1) Online realtime chemical monitoring
(2) SEMI minienvironment ergonomic
1990 Needs
(2) DI water recycle process control
guideline
0.18 µm/
(1) ISO ESH standards compatibility Reduced
2001 Needs
gowning requirements in cleanroom
MATERIALS
MODELING/SIMULATION
0.35 µm/
(1) Chemical, energy, and water mass balance
1995 Needs
(1) Risk assessment
(1) CoO
(2) Chemical use optimization
0.25 µm/
(4) Cyanide-free plating
1990 Needs
(3) Non-heavy-metal opaquing of masks
0.18 µm/
(2) DFESH integrated with semiconductor
2001 Needs
design tools
0.10 µm/
(1) Hydride alternative
2007 Needs
(2) Pb-free solder
QUALITY AND RELIABILITY
STANDARDS
0.35 µm/
(2) SEMI ergonomic guideline
1995 Needs
0.25 µm/
Validate ultrapure water and chemical quality
(2) SEMI S2 certification process
1990 Needs
specifications
(1) ESH CoO
(3) Maintain updated SEMI ESH guidelines
consistent with technology development
0.18 µm/
(1) ISO ESH standards compatibility
2001 Needs
Testing and analytical methodologies
TRAINING/EDUCATION
0.35 um/
Train semiconductor process development
1995 Needs
engineers and suppliers on DFESH
POTENTIAL PARADIGM SHIFTS
To achieve the goals of the Roadmap, ESH ownership must exist at the highest manage-
ment level throughout the industry. Examples of actions are as follows:
Integrate and implement DFESH elements in all aspects of tool, process, and facility
design and management.
Investigate new forces that drive ESH activities in the industry beyond meeting
regulations and acquiring permits.
Eliminate the reliance on garments to isolate people from product in new facilities.
Significantly reduce the use of hazardous chemicals in wafer manufacturing and
assembly processes.
Develop feasible additive processes.
74
80
Environment, Safety, and Health
SUMMARY
The key elements for ESH continuous improvement are the reduction of hazardous chemi-
cals use, the reduction of energy and water use, and the evolution of worker
protection/ergonomics programs, including the application of ergonomics in tool and factory
design and operation. The key tools needed are chemical, energy, and water mass balance,
ESH cost of ownership, and risk assessment. They should be used systematically by suppli-
ers and producers to achieve DFESH.
As ESH awareness continues to build in the semiconductor community, this learning needs
to be incorporated into the equipment, device, and factory design models. ESH concerns
need to be addressed in the earliest stages of technology, process, product development,
factory design, and manufacturing.
This ESH roadmap, successfully implemented, will continue to enhance the industry as a
data-driven, cost-conscious, proactive leader in environmental protection, worker safety,
and health programs.
75
Appendix I
77
SEMICONDUCTOR RESEARCH CORPORATION
JRC
August 4, 1994
CONTACT:
Ben Kittner
COOPERATIVE
RESEARCH
Semiconductor Research Corp. (SRC)
919/821-0900
-or-
Scott Stevens
SEMATECH
512/356-3423
SEMATECH FUNDS FOUR NEW ENVIRONMENTAL RESEARCH PROJECTS TO BE MANAGED BY
THE SEMICONDUCTOR RESEARCH CORP.
- Research to be Conducted at Four Universities:
U. of Arizona, N. C. State, Stanford and U. of Texas -
AUSTIN, TEX. AND RESEARCH TRIANGLE PARK, N.C. - SEMATECH has funded four
new university-based environment, safety and health (ES&H) research projects. The
Semiconductor Research Corp. (SRC) has worked closely with SEMATECH to define these
projects and put them in place. The projects will be managed by the SRC.
Two projects will focus on water use in the semiconductor manufacturing process,
the third relates to chemical use, and the fourth will study the lithography process.
"Our goal is to initiate these new projects immediately," said H. Ray Kerby,
SEMATECH's director of environment, safety and health. "The semiconductor industry is
committed to environmental quality. The addition of these projects to this year's research
agenda is a good example of that commitment."
"The SRC currently funds and manages 28 research projects with identified ES&H
objectives at 15 universities around the United States," said Larry W. Sumney, SRC
president and CEO. "By putting these projects in place, the SRC is responding directly to
priority research needs expressed by the SRC's participating companies and
organizations."
SEMATECH's 1994 contract with the SRC is now approximately $11 million, which is
used to fund long-range research at universities and other research institutions.
--more-
ES&H Projects Funded
August 4, 1994
-2-2-2-2-
SEMATECH will spend approximately $20 million this year on environmental technology
development programs. The SRC's total research budget is $28 million, of which
approximately $1.6 million is invested in projects related to the environment, safety and
health.
The four new environment, safety & health projects are:
University of Arizona - Developing tools and techniques to overcome technical
obstacles related to ultra-pure water recycling and discharge minimization in
semiconductor manufacturing.
Stanford University - Providing critical models, methodologies and sensors to
optimize surface preparation and deionized water rinses. This will achieve lower water
use and costs in semiconductor manufacturing, as well as better overall performance
(including yield, throughput and reliability).
North Carolina State University - Determining methods to sense emissions which
might be environmentally harmful and optimizing processes and equipment to reduce
emissions.
University of Texas - Developing new resist materials designed to minimize the
environmental impact of the lithography process. This research will include an exploration
of new imaging chemistry that could provide a means for water-borne coating and
development.
SEMATECH and the SRC are working together to achieve industry-wide ES&H
goals set forth in the National Technology Roadmap for Semiconductors, coordinated
through the Semiconductor Industry Association.
SEMATECH, a consortium of 11 major U.S. semiconductor companies, seeks to
develop semiconductor manufacturing technology to keep the U.S. industry competitive. It
is based in Austin, Texas.
The SRC is a consortium of more than 60 semiconductor companies and government
agencies. It plans and implements an integrated program of pre-competitive research
conducted at 62 North American universities, national laboratories and research
institutions. The SRC is based in Research Triangle Park, N.C.
####
SEMATECH
2706 Montopolis Drive Austin, Texas 78741-6499 512-356-3500
For more information:
Scott Stevens
SEMATECH
BACKGROUNDER
(512) 356-3423
Ben Kittner
Semiconductor Research Corp.
(919) 821-0900
Water Conservation High Priority for High Tech
AUSTIN, Texas, August 4, 1994 -- At one time conventional wisdom held
that high-quality groundwater was a renewable resource. Not many
people believe that any more.
The semiconductor industry, which consumes large quantities of
water to manufacture computer chips, is moving water conservation and
recycling programs very high on its priority list.
Because of water's perceived abundance and its relatively low
cost, water conservation has not received the same level of attention
as waste minimization and chemical substitution. All of that has
changed in the 1990s.
Chipmakers reclaim some of their water and use it in plant
cooling systems or in irrigation even in some non-critical
manufacturing processes. But reclaimed water is not generally used to
rinse impurities off silicon wafers during the numerous steps required
to manufacture computer chips; the rinsing process requires ultra-pure
water.
SEMATECH recently funded water research projects at two U.S.
universities. The University of Arizona in Tucson is focusing on a
recycle and waste minimization project in ultra-pure water systems.
Stanford University is working on a project related to process water
requirements and optimization, with the ultimate goal of lowering
water use and costs. The Semiconductor Research Corp. (SRC) worked
closely with SEMATECH to define these projects and put them in place.
The SRC is managing these two programs for SEMATECH.
The long-term goal of the University of Arizona project is to
develop the tools and techniques needed to overcome the technical
obstacles related to ultra-pure water recycling and discharge
minimization in the semiconductor industry.
- more -
A Team of America's Best Advanced Micro Devices, Inc. Advanced Research Projects Agency (ARPA) American Telephone and Telegraph Company
Digital Equipment Corporation Hewlett-Packard Company Intel Corporation International Business Machines Corporation Motorola, Inc.
SEMATECH/page 2
The Stanford program will provide critical models, methodologies
and sensors to optimize surface preparation and de-ionized water
rinses. This will achieve lower water use and costs in semiconductor
manufacturing, as well as better overall performance, including yield,
throughput and reliability.
These two projects complement a program on process water
recycling which SEMATECH initiated in October 1993. The objective of
that program is to determine the current status and assess future
needs, establish a standard for the cost of recycle systems, and
determine both the benefits and risks of recycle systems. The
approach includes a comprehensive, computer-based cost model and a
benefit and risk assessment tool.
"Water conservation and recycling has been included as a
technology requirement on the National Technology Roadmap for
Semiconductors," said H. Ray Kerby, SEMATECH's director of
environment, safety and health programs. The technology roadmap was
developed by the Semiconductor Industry Association in conjunction
with SEMATECH and the SRC.
"These two university-based research projects have a strategic
fit with the industry roadmap," according to SRC President and CEO
Larry Sumney. "The project results will be applicable to many of the
technology focus areas such as Future Factory and Contamination Free
Manufacturing."
Earlier this year, SEMATECH co-sponsored the International Clean
Water Conference in San Jose, Calif. Both the Semiconductor Industry
Association and the Semiconductor Safety Association worked with
SEMATECH to promote water conservation awareness and discussion within
the industry. The objective was to accelerate the technology of
industrial water management through a collaborative effort.
"We are fully aware that there is a bottom to the well and that
the well could run dry if we don't do something," says Frank Squires,
SEMATECH's chief administrative officer. "As we continue to focus on
this issue, we realize that there has been a great deal of individual
effort. But since there has been little communication and sharing of
information on this subject, SEMATECH is forging a coordinated effort
of information exchange.'
- more -
SEMATECH/page 3
In addition to the international symposium, SEMATECH plans to
share the results of its environmental, safety and health research
programs on a global basis.
Although SEMATECH does not release the dollar amount of any of
its contracts, these two new projects bring SEMATECH's annual contract
with the SRC in 1994 to approximately $11 million to fund long-range
research at more than 30 universities and research institutions across
the country.
As part of its mission to solve the technical challenges of
keeping the U.S. number one in the global semiconductor industry,
SEMATECH is on target this year to spend approximately $20 million on
major environmental, safety and health programs.
The programs--more than 30 this year alone--reflect the
commitment of the consortium, its member companies and the federal
government to develop and demonstrate environment, safety and health-
conscious manufacturing technologies.
###
EDITOR'S NOTE:
SEMATECH, a consortium of 11 major U.S. semiconductor companies and
the Department of Defense, seeks to develop semiconductor
manufacturing technology to keep the U.S. industry competitive. It is
based in Austin, Texas.
The SRC is a consortium of more than 60 semiconductor companies and
government agencies. It plans and implements an integrated program of
pre-competitive research conducted at 62 North American universities,
national laboratories and research institutions. The SRC is based in
Research Triangle Park, N.C.
SEMICONDUCTOR RESEARCH CORPORATION
SRC
November 2, 1994
CONTACT:
Ben Kittner
COOPERATIVE
RESEARCH
Semiconductor Research Corp. (SRC)
919/821-0900
-or-
Scott Stevens
SEMATECH
512/356-3423
SEMATECH FUNDS Two NEW ENVIRONMENTAL RESEARCH PROJECTS TO BE
MANAGED BY THE SEMICONDUCTOR RESEARCH CORP.
- Research to be Conducted at MIT -
AUSTIN, TEX. AND RESEARCH TRIANGLE PARK, N.C. - SEMATECH has funded
two new university-based environment, safety and health (ES&H) research projects.
The Semiconductor Research Corp. (SRC) worked closely with SEMATECH to define
these projects and will manage them.
Research for the projects will take place at the Massachusetts Institute of
Technology (MIT) in Cambridge, Mass., and will seek to reduce emissions from the
semiconductor manufacturing process that may be harmful to the environment.
"These new projects, as well as previous SEMATECH-SRC ES&H projects,
demonstrate the semiconductor industry's commitment to environmental quality and
efforts to minimize the impact of the semiconductor manufacturing process," said
H. Ray Kerby, SEMATECH's director of environment, safety and health.
"The more than 60 participating companies and organizations that make up the
SRC have indicated that ES&H is a priority research need," said Larry W. Sumney, SRC
president and CEO. "In response to our customers, the SRC will add these new projects
at MIT to a growing list of SRC-managed ES&H research projects at 15 U.S. universities."
The new environment, safety & health projects at MIT are:
Study of PFC Emission and Abatement for Plasma Processes - this research
will measure and model the kinetics of perfluorocompounds (PFCs) released from
--more-
ES&H Projects Funded at MIT
November 2, 1994
-2-2-2-2-
plasma processes used in the manufacture of microelectronics. The research will also
develop and test abatement processes to lessen these emissions. PFCs are suspected of
contributing to global warming.
Non-Perfluorocompound Replacements for Wafer Etching and PECVD
Chamber Cleaning - - this research will investigate alternatives for the PFC gases used in
two main processes of semiconductor manufacturing, wafer etching and plasma
enhanced chemical vapor deposition (PECVD) chamber cleaning.
SEMATECH and the SRC are working together to achieve industry-wide ES&H
goals set forth in the National Technology Roadmap for Semiconductors, coordinated
by the Semiconductor Industry Association.
SEMATECH's 1994 contract with the SRC is approximately $11 million, which is
used to fund long-range research at universities and other research institutions. By the
end of this year, SEMATECH will have spent approximately $20 million on
environmental technology development programs. The SRC's total research budget this
year is $28 million, of which approximately $1.6 million is invested in ES&H projects.
SEMATECH, based in Austin, Tex., is a consortium of 11 major U.S.
semiconductor companies that seeks to develop manufacturing technology to keep the
U.S. semiconductor industry competitive.
The SRC is a consortium of more than 60 semiconductor companies and
government agencies. It plans and implements an integrated program of pre-
competitive research conducted at 62 North American universities, national laboratories
and research institutions. The SRC is based in Research Triangle Park, N.C.
####
NREL
NEWS
Public Affairs
1617 Cole Boulevard
Golden, Colorado 80401-3393
303/275-4090
FOR INFORMATION CONTACT:
Mike Coe, NREL (303) 275-4085
John Pope, SEMATECH (512) 356-3486
NREL, SEMATECH SEEK TO CURB AIR EMISSIONS
Golden, Colo., September 2, 1994 - The U.S. Department of Energy's National Renewable Energy
Laboratory (NREL) and SEMATECH, the semiconductor manufacturing research consortium, today
announced a cooperative research and development agreement (CRADA) to explore the feasibility of
the semiconductor industry using an emission abatement technology based on ultraviolet light.
The technology, photocatalytic oxidation, is under development at NREL and International
Technology Corporation of Knoxville, Tenn. It uses ultraviolet light and a catalyst to destroy volatile
organic compounds. SEMATECH, based in Austin, Texas, is considering the technology to destroy
volatile organic compounds generated by semiconductor manufacturing processes. Photocatalytic
oxidation could further reduce air emissions as well as lower operating costs for semiconductor
makers.
"The agreement is part of SEMATECH's proactive effort to identify and use improved waste
treatment technologies that reduce emissions to the environment," said NREL project manager Craig
Turchi.
"This is yet another example of the semiconductor industry collaborating with government to
develop leading-edge technology," said H. Ray Kerby, SEMATECH's director of environment, safety
and health. "One of SEMATECH's priority environmental programs is the treatment and monitoring
of air emissions. This is a very complex program, and we believe teaming with NREL could provide
us with additional technology to protect the environment."
The photocatalytic system consists of a reactor vessel, an acid gas scubber, an exhaust
blower and other system components such as monitoring instruments and controllers. Air emission
streams are fed into the reactor where ultraviolet light activates the catalyst, titanium dioxide,
initiating a chemical reaction that destroys compounds before being emitted to the atmosphere.
Under the CRADA, NREL will perform laboratory and on-site tests on various air emission
streams identified by SEMATECH. SEMATECH will then compare the effectiveness and cost of
photocatalytic oxidation with other waste-minimizing technologies that are under consideration for
commercialization.
###
NR-03194
The National Renewable Energy Laboratory (NREL) is operated and managed for the U.S. Department of Energy by the Midwest Research Institute.
SEMATECH
2706 Montopolis Drive . Austin, Texas 78741-6499 512-356-3500
FOR IMMEDIATE RELEASE
FOR MORE INFORMATION:
Scott Stevens (512) 356-3423
SEMATECH RECEIVES TWO ENVIRONMENTAL AWARDS
FROM CITY OF AUSTIN
AUSTIN, Texas (July 6, 1994) -The City of Austin honored both SEMATECH
and one of the company's employees with Environmental Awareness Awards at a
June 29 ceremony. The awards recognized individuals and groups at SEMATECH
who have made "significant contributions to the protection and preservation of Austin's
environment." Representing the third and fourth environmental honors for
SEMATECH this year, the awards were sponsored by the City of Austin Environmental
Board, Resource Management Commission and the Solid Waste Advisory
Commission.
SEMATECH received the Non-profit Organization Award for the company's
on-site recycling program. D. W. Brown, a SEMATECH employee, received the Beth
Brown Boettner Award for individual Achievement. Brown, an equipment engineer
was recognized for his volunteer efforts in collection of water samples at Onion Creek
and McKinney Falls in Austin. These samples were used to help verify water quality
and that swimming was safe in McKinney Falls.
The SEMATECH Recycling Council was recognized for excellence in solid
waste management. Although the employees have practiced recycling since the
consortium's start-up, SEMATECH's volunteers increased efforts a year ago toward
awareness among co-workers, who began to recycle record volumes of paper, plastic,
aluminum, metals, glass and chemicals. They also hit the streets of the Montopolis
community to pick up trash and join the neighbors in keeping the area clean.
"We now reduce, reuse or recycle practically every one of our resources," said
Frank Squires, chief administrative officer and sponsor of the recycling program. "The
lessons we're learning are being applied in the community and throughout our
industry."
- MORE -
A Team of America's Best Advanced Micro Devices, Inc. Advanced Research Projects Agency (ARPA) . American Telephone and Telegraph Company
Digital Equipment Corporation Hewlett-Packard Company Intel Corporation International Business Machines Corporation Motorola, Inc.
National Semiconductor Corporation NCR Corporation Rockwell International Corporation Texas Instruments Incorporated
SEMATECH AWARD/2
Employees developed a rallying message for their environmental work and
painted it on the outside of the SEMATECH facility in three-foot letters for motorists
passing on Oltorf Street to see. The message, "SEMATECH Recycling: Preserving
More Than American Jobs," is intended to build on the consortium's overall mission of
solving the technical challenges required to keep the U.S. number one in the global
semiconductor industry.
"Focusing on how to recycle our resources is a fundamental factor in running
our businesses cleaner and more efficiently," noted Squires.
Environmental accomplishments contributing to SEMATECH's winning the
award included:
Employee volunteers organized a SEMATECH Recycling Council to coordinate the
efforts and track the results.
An internal audit was conducted to identify how to recycle more products, then
employees were kept up-to-date on their recycling progress.
The Recycling Center, a collection point for numerous recyclable materials, was
designed and built on-site.
An awareness campaign of good recycling habits was conducted among employees,
including placement of boxes for collecting recyclable paper at all desks and
conference rooms.
Buying Recycled Products Corporate Guideline was established, allowing
SEMATECH to purchase recycled products, even if at an increased cost of up to five
percent more than non-recycled products. However, SEMATECH ultimately realized a
cost savings of nearly $1.3 million during 1993 through purchases of such goods as
reclaimed oil, reclaimed wafers and paper goods.
Sixty tons of recycled copier machine paper were purchased, saving about 1,020
mature pulp trees.
Thirty-five tons of recyclable office paper and cardboard were collected and sent to
the paper mill, saving another 595 trees.
-MORE-
SEMATECH AWARD/3
Styrofoam cup usage has been reduced and emphasis placed on employees' resuse
of plastic cups throughout the facility.
Neighborhood groups toured the facility's operations and discussed environmental
safety with employees.
Lessons learned for improving the environment are being shared with the community
through such allies as the Capital Area Corporate Recycling Council, an organization
of corporate and private businesses that exchange information and techniques for
improving their environmental efforts.
SEMATECH member companies are acting as both resources and recipients
for lessons to be learned in how to develop and demonstrate environment, safety and
health-conscious manufacturing technologies.
SEMATECH's local recycling success reflects the commitment of the
consortium, its member companies and the federal government to develop and
demonstrate environment, safety and health-conscious manufacturing technologies.
The programs range from reducing facility operation emissions, including global
warming agents, to conserving energy and improving safety practices. The initiatives
are synchronized with a 15-year national technology "roadmap" that was influenced by
SEMATECH and others in the semiconductor industry to include a section focusing
specifically on environment, safety and health issues.
"We're establishing a roadmap that targets a semiconductor manufacturing
process with zero environmental impact," Squires said. "Our recycling progress at all
product levels can significantly contribute to achieving that goal."
SEMATECH is a consortium of U.S. semiconductor manufacturers and the
Department of Defense which conducts research in semiconductor manufacturing
technology. Its mission is to solve the technical challenges to keep the U.S. number
one in the global semiconductor industry.
###